Body Features Heat Sink Finish : Anodized Black Heat Sink Height (INCH) : .255 Heat Sink Height Class : SAN Heat Sink Style : Pin
Configuration Features Number of Ports : 1 Number of Rear EONs per Port Column : 2 Port Matrix Configuration : 1 x 1
Electrical Characteristics Data Rate (Max) (GBS) : 10
Housing Features Cage Material : Copper Alloy
Operation/Applicatio
n Circuit Application : Signal
Other Included Lightpipe : No
Packaging Features Packaging Method : Tray
Product Type Features Cage Type : Single Form Factor : QSFP+ Pluggable I/O Product Type : Cage Assembly Sealable : No Thermal Accessory Type Included : Heat Sink
Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Body Features
- Heat Sink Finish : Anodized Black
- Heat Sink Height (INCH) : .255
- Heat Sink Height Class : SAN
- Heat Sink Style : Pin
Configuration Features
- Number of Ports : 1
- Number of Rear EONs per Port Column : 2
- Port Matrix Configuration : 1 x 1
Electrical Characteristics
- Data Rate (Max) (GBS) : 10
Housing Features
- Cage Material : Copper Alloy
Operation/Application
- Circuit Application : Signal
Other
Packaging Features
Product Type Features
- Cage Type : Single
- Form Factor : QSFP+
- Pluggable I/O Product Type : Cage Assembly
- Sealable : No
- Thermal Accessory Type Included : Heat Sink
Termination Features
- Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions
- Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
