Contact Features Contact Current Rating (Max) (AMP) : 3 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness (MICIN) : 15 Contact Orientation : Straight Contact Type : Socket PCB Contact Termination Area Plating Material : Tin
Dimensions Compatible Insulation Diameter Range (MM) : 1.2 Wire Size (MMSQ) : .05 - .12 Wire Size (AWG) : 30 - 26
Mechanical Attachment Contact Retention Type Within Housing : Snap-In PCB Mount Retention : Without Wire Insulation Support : With
Operation/Applicatio
n Circuit Application : Power & Signal
Packaging Features Packaging Quantity : 20000
Termination Features Product Terminates To : Wire & Cable
Usage Conditions Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
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Description
Contact Features Contact Current Rating (Max) (AMP) : 3 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness (MICIN) : 15 Contact Orientation : Straight Contact Type : Socket PCB Contact Termination Area Plating Material : Tin
Dimensions Compatible Insulation Diameter Range (MM) : 1.2 Wire Size (MMSQ) : .05 - .12 Wire Size (AWG) : 30 - 26
Mechanical Attachment Contact Retention Type Within Housing : Snap-In PCB Mount Retention : Without Wire Insulation Support : With
Operation/Applicatio
n Circuit Application : Power & Signal
Packaging Features Packaging Quantity : 20000
Termination Features Product Terminates To : Wire & Cable
Usage Conditions Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
Contact Features Contact Current Rating (Max) (AMP) : 3 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness (MICIN) : 15 Contact Orientation : Straight Contact Type : Socket PCB Contact Termination Area Plating Material : Tin
Dimensions Compatible Insulation Diameter Range (MM) : 1.2 Wire Size (MMSQ) : .05 - .12 Wire Size (AWG) : 30 - 26
Mechanical Attachment Contact Retention Type Within Housing : Snap-In PCB Mount Retention : Without Wire Insulation Support : With
Operation/Applicatio
n Circuit Application : Power & Signal
Packaging Features Packaging Quantity : 20000
Termination Features Product Terminates To : Wire & Cable
Usage Conditions Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
Contact Features
Contact Current Rating (Max) (AMP) : 3
Contact Mating Area Plating Material : Gold (Au)
Contact Mating Area Plating Material Thickness (MICIN) : 15
Contact Orientation : Straight
Contact Type : Socket
PCB Contact Termination Area Plating Material : Tin
Dimensions
Compatible Insulation Diameter Range (MM) : 1.2
Wire Size (MMSQ) : .05 - .12
Wire Size (AWG) : 30 - 26
Mechanical Attachment
Contact Retention Type Within Housing : Snap-In
PCB Mount Retention : Without
Wire Insulation Support : With
Operation/Application
Circuit Application : Power & Signal
Packaging Features
Packaging Quantity : 20000
Termination Features
Product Terminates To : Wire & Cable
Usage Conditions
Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
