Body Features Frame Style : Square
Configuration Features Grid Spacing : .914 x .914 MM [.036 x .036 INCH ] Number of Positions : 1150
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 15 IC Socket Type : LGA 1150
Housing Features Centerline (Pitch) : .91 MM [.036 INCH ] Housing Color : Black Housing Material : High Temperature Thermoplastic
Industry Standards UL Flammability Rating : UL 94V-0
Mechanical Attachment Connector Mounting Type : Board Mount PCB Mounting Style : Surface Mount Solder Ball
Operation/Applicatio
n Circuit Application : Signal
Other Socket Connector Comment : Lead-Free Solderball
Packaging Features Packaging Method : Bag Tray Color : Black
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board
Usage Conditions Operating Temperature Range : -25 - 100 DEGC [-13 - 212 DEGF ]
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Description
Body Features Frame Style : Square
Configuration Features Grid Spacing : .914 x .914 MM [.036 x .036 INCH ] Number of Positions : 1150
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 15 IC Socket Type : LGA 1150
Housing Features Centerline (Pitch) : .91 MM [.036 INCH ] Housing Color : Black Housing Material : High Temperature Thermoplastic
Industry Standards UL Flammability Rating : UL 94V-0
Mechanical Attachment Connector Mounting Type : Board Mount PCB Mounting Style : Surface Mount Solder Ball
Operation/Applicatio
n Circuit Application : Signal
Other Socket Connector Comment : Lead-Free Solderball
Packaging Features Packaging Method : Bag Tray Color : Black
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board
Usage Conditions Operating Temperature Range : -25 - 100 DEGC [-13 - 212 DEGF ]
Body Features Frame Style : Square
Configuration Features Grid Spacing : .914 x .914 MM [.036 x .036 INCH ] Number of Positions : 1150
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 15 IC Socket Type : LGA 1150
Housing Features Centerline (Pitch) : .91 MM [.036 INCH ] Housing Color : Black Housing Material : High Temperature Thermoplastic
Industry Standards UL Flammability Rating : UL 94V-0
Mechanical Attachment Connector Mounting Type : Board Mount PCB Mounting Style : Surface Mount Solder Ball
Operation/Applicatio
n Circuit Application : Signal
Other Socket Connector Comment : Lead-Free Solderball
Packaging Features Packaging Method : Bag Tray Color : Black
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board
Usage Conditions Operating Temperature Range : -25 - 100 DEGC [-13 - 212 DEGF ]
Body Features
Frame Style : Square
Configuration Features
Grid Spacing : .914 x .914 MM [.036 x .036 INCH ]
Number of Positions : 1150
Contact Features
Contact Base Material : Copper Alloy
Contact Current Rating (Max) (AMP) : .5
Contact Mating Area Plating Material : Gold
Contact Mating Area Plating Material Thickness (MICIN) : 15
IC Socket Type : LGA 1150
Housing Features
Centerline (Pitch) : .91 MM [.036 INCH ]
Housing Color : Black
Housing Material : High Temperature Thermoplastic
Industry Standards
UL Flammability Rating : UL 94V-0
Mechanical Attachment
Connector Mounting Type : Board Mount
PCB Mounting Style : Surface Mount Solder Ball
Operation/Application
Circuit Application : Signal
Other
Socket Connector Comment : Lead-Free Solderball
Packaging Features
Packaging Method : Bag
Tray Color : Black
Product Type Features
Connector & Contact Terminates To : Printed Circuit Board
Connector System : Board-to-Board
Usage Conditions
Operating Temperature Range : -25 - 100 DEGC [-13 - 212 DEGF ]