TE Connectivity
Connector Contacts
212014-2
Description
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 32 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ] Contact Size : Size 8 Contact Type : Socket Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Gold
Dimensions Compatible Insulation Diameter Range : .1 MM [.003 - .035 INCH ] Wire Size (MMSQ) : .8 - 1.4 Wire Size (AWG) : 18 - 16
Mechanical Attachment Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Package Packaging Quantity : 1
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Crimp
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
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Description
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 32 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ] Contact Size : Size 8 Contact Type : Socket Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Gold
Dimensions Compatible Insulation Diameter Range : .1 MM [.003 - .035 INCH ] Wire Size (MMSQ) : .8 - 1.4 Wire Size (AWG) : 18 - 16
Mechanical Attachment Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Package Packaging Quantity : 1
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Crimp
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
Request a Quote
Email Supplier
Suppliers
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 32 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ] Contact Size : Size 8 Contact Type : Socket Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Gold
Dimensions Compatible Insulation Diameter Range : .1 MM [.003 - .035 INCH ] Wire Size (MMSQ) : .8 - 1.4 Wire Size (AWG) : 18 - 16
Mechanical Attachment Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Package Packaging Quantity : 1
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Crimp
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
Contact Features
- Contact Base Material : Copper Alloy
- Contact Current Rating (Max) (AMP) : 32
- Contact Mating Area Plating Material : Gold (Au)
- Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ]
- Contact Size : Size 8
- Contact Type : Socket
- Contact Underplating Material : Nickel
- PCB Contact Termination Area Plating Material : Gold
Dimensions
- Compatible Insulation Diameter Range : .1 MM [.003 - .035 INCH ]
- Wire Size (MMSQ) : .8 - 1.4
- Wire Size (AWG) : 18 - 16
Mechanical Attachment
- Wire Insulation Support : Without
Operation/Application
- Circuit Application : Power
Packaging Features
- Packaging Method : Package
- Packaging Quantity : 1
Termination Features
- Product Terminates To : Wire & Cable
- Termination Method to Wire & Cable : Crimp
Usage Conditions
- Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
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Technical Specifications
|
Product Category
|
Wire Terminals |
|
Product Number
|
212014-2 |
|
Product Name
|
Connector Contacts |
|
Features
|
RoHS
|
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