Body Features Primary Product Color : Natural
Configuration Features Board-to-Board Configuration : Parallel Number of Positions : 320 Number of Rows : 8 PCB Mount Orientation : Vertical Stackable : Yes
Contact Features Contact Base Material : Beryllium Copper Contact Current Rating (Max) (AMP) : 1.5 Contact Layout : Matrix Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Finish : Bright Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] Contact Shape & Form : Square Contact Type : Socket Contact Underplating Material : Nickel Mating Tab Thickness : .46 MM [.017 INCH ] Mating Tab Width : .43 MM [.017 INCH ] PCB Contact Termination Area Plating Material : Tin-Lead
Dimensions PCB Thickness (Recommended) : 2.36 MM [.093 INCH ] Row-to-Row Spacing : 1.27 MM [.05 INCH ] Stack Height : 10 MM [.394 INCH ]
Electrical Characteristics Dielectric Withstanding Voltage (Max) (VAC) : 750 Operating Voltage (VAC) : 250
Housing Features Centerline (Pitch) : 1.27 MM [.05 INCH ] Housing Material : Liquid Crystal Polymer (LCP) Mating Entry Location : Top
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : Self-Aligning (Alignment Free), Polarizing Rib PCB Mount Alignment : Without PCB Mount Retention : Without PCB Mount Retention Type : Solder Ball
Operation/Applicatio
n Assembly Process Feature : Pick and Place Cover Circuit Application : Signal
Packaging Features Packaging Method : Pocket Tape
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector Product Type : Connector Assembly Connector System : Board-to-Board PCB Connector Type : PCB Mount Receptacle Sealable : No
Signal Characteristics Data Rate (GBS) : 10
Termination Features Termination Method to PCB : Surface Mount - Solder Ball
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
Body Features
- Primary Product Color : Natural
Configuration Features
- Board-to-Board Configuration : Parallel
- Number of Positions : 320
- Number of Rows : 8
- PCB Mount Orientation : Vertical
- Stackable : Yes
Contact Features
- Contact Base Material : Beryllium Copper
- Contact Current Rating (Max) (AMP) : 1.5
- Contact Layout : Matrix
- Contact Mating Area Plating Material : Gold (Au)
- Contact Mating Area Plating Material Finish : Bright
- Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ]
- Contact Shape & Form : Square
- Contact Type : Socket
- Contact Underplating Material : Nickel
- Mating Tab Thickness : .46 MM [.017 INCH ]
- Mating Tab Width : .43 MM [.017 INCH ]
- PCB Contact Termination Area Plating Material : Tin-Lead
Dimensions
- PCB Thickness (Recommended) : 2.36 MM [.093 INCH ]
- Row-to-Row Spacing : 1.27 MM [.05 INCH ]
- Stack Height : 10 MM [.394 INCH ]
Electrical Characteristics
- Dielectric Withstanding Voltage (Max) (VAC) : 750
- Operating Voltage (VAC) : 250
Housing Features
- Centerline (Pitch) : 1.27 MM [.05 INCH ]
- Housing Material : Liquid Crystal Polymer (LCP)
- Mating Entry Location : Top
Mechanical Attachment
- Connector Mounting Type : Board Mount
- Mating Alignment : With
- Mating Alignment Type : Self-Aligning (Alignment Free), Polarizing Rib
- PCB Mount Alignment : Without
- PCB Mount Retention : Without
- PCB Mount Retention Type : Solder Ball
Operation/Application
- Assembly Process Feature : Pick and Place Cover
- Circuit Application : Signal
Packaging Features
- Packaging Method : Pocket Tape
Product Type Features
- Connector & Contact Terminates To : Printed Circuit Board
- Connector Product Type : Connector Assembly
- Connector System : Board-to-Board
- PCB Connector Type : PCB Mount Receptacle
- Sealable : No
Signal Characteristics
Termination Features
- Termination Method to PCB : Surface Mount - Solder Ball
Usage Conditions
- Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
