TE Connectivity PCB Headers & Receptacles 2102061-8

Description
Body Features Primary Product Color : Natural Configuration Features Board-to-Board Configuration : Parallel Number of Positions : 114 Number of Rows : 6 PCB Mount Orientation : Vertical Stackable : Yes Contact Features Contact Base Material : Beryllium Copper Contact Current Rating (Max) (AMP) : 1.5 Contact Layout : Matrix Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Finish : Bright Contact Mating Area Plating Material Thickness : .76 MICM  [29.9212 MICIN ] Contact Shape & Form : Square Contact Type : Socket Contact Underplating Material : Nickel Mating Tab Thickness : .46 MM  [.018 INCH ] Mating Tab Width : .43 MM  [.017 INCH ] Dimensions Connector Height : 8 MM  [.314 INCH ] PCB Thickness (Recommended) : 2.36 MM  [.093 INCH ] Row-to-Row Spacing : 1.27 MM  [.05 INCH ] Stack Height : 12 MM  [.472 INCH ] Electrical Characteristics Dielectric Withstanding Voltage (Max) (VAC) : 750 Operating Voltage (VAC) : 250 Housing Features Centerline (Pitch) : 1.27 MM  [.05 INCH ] Housing Material : LCP (Liquid Crystal Polymer) Mating Entry Location : Top Industry Standards Industry Standard : VITA 61 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : Polarizing Tab PCB Mount Alignment : Without PCB Mount Alignment Type : None PCB Mount Retention : Without PCB Mount Retention Type : Solder Ball Operation/Applicatio n Assembly Process Feature : Pick and Place Cover Circuit Application : Signal Packaging Features Packaging Quantity : 350 Packaging Type : Tape & Reel Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Assembly Type : PCB Mount Receptacle Sealable : No Termination Features Termination Method to Printed Circuit Board : Surface Mount - Solder Ball Usage Conditions Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]
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Description
Body Features Primary Product Color : Natural Configuration Features Board-to-Board Configuration : Parallel Number of Positions : 114 Number of Rows : 6 PCB Mount Orientation : Vertical Stackable : Yes Contact Features Contact Base Material : Beryllium Copper Contact Current Rating (Max) (AMP) : 1.5 Contact Layout : Matrix Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Finish : Bright Contact Mating Area Plating Material Thickness : .76 MICM  [29.9212 MICIN ] Contact Shape & Form : Square Contact Type : Socket Contact Underplating Material : Nickel Mating Tab Thickness : .46 MM  [.018 INCH ] Mating Tab Width : .43 MM  [.017 INCH ] Dimensions Connector Height : 8 MM  [.314 INCH ] PCB Thickness (Recommended) : 2.36 MM  [.093 INCH ] Row-to-Row Spacing : 1.27 MM  [.05 INCH ] Stack Height : 12 MM  [.472 INCH ] Electrical Characteristics Dielectric Withstanding Voltage (Max) (VAC) : 750 Operating Voltage (VAC) : 250 Housing Features Centerline (Pitch) : 1.27 MM  [.05 INCH ] Housing Material : LCP (Liquid Crystal Polymer) Mating Entry Location : Top Industry Standards Industry Standard : VITA 61 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : Polarizing Tab PCB Mount Alignment : Without PCB Mount Alignment Type : None PCB Mount Retention : Without PCB Mount Retention Type : Solder Ball Operation/Applicatio n Assembly Process Feature : Pick and Place Cover Circuit Application : Signal Packaging Features Packaging Quantity : 350 Packaging Type : Tape & Reel Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Assembly Type : PCB Mount Receptacle Sealable : No Termination Features Termination Method to Printed Circuit Board : Surface Mount - Solder Ball Usage Conditions Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]
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Suppliers

Company
Product
Description
Supplier Links
PCB Headers & Receptacles - 2102061-8 - TE Connectivity
Berwyn, PA, United States
PCB Headers & Receptacles
2102061-8
PCB Headers & Receptacles 2102061-8
Body Features Primary Product Color : Natural Configuration Features Board-to-Board Configuration : Parallel Number of Positions : 114 Number of Rows : 6 PCB Mount Orientation : Vertical Stackable : Yes Contact Features Contact Base Material : Beryllium Copper Contact Current Rating (Max) (AMP) : 1.5 Contact Layout : Matrix Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Finish : Bright Contact Mating Area Plating Material Thickness : .76 MICM  [29.9212 MICIN ] Contact Shape & Form : Square Contact Type : Socket Contact Underplating Material : Nickel Mating Tab Thickness : .46 MM  [.018 INCH ] Mating Tab Width : .43 MM  [.017 INCH ] Dimensions Connector Height : 8 MM  [.314 INCH ] PCB Thickness (Recommended) : 2.36 MM  [.093 INCH ] Row-to-Row Spacing : 1.27 MM  [.05 INCH ] Stack Height : 12 MM  [.472 INCH ] Electrical Characteristics Dielectric Withstanding Voltage (Max) (VAC) : 750 Operating Voltage (VAC) : 250 Housing Features Centerline (Pitch) : 1.27 MM  [.05 INCH ] Housing Material : LCP (Liquid Crystal Polymer) Mating Entry Location : Top Industry Standards Industry Standard : VITA 61 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : Polarizing Tab PCB Mount Alignment : Without PCB Mount Alignment Type : None PCB Mount Retention : Without PCB Mount Retention Type : Solder Ball Operation/Applicatio n Assembly Process Feature : Pick and Place Cover Circuit Application : Signal Packaging Features Packaging Quantity : 350 Packaging Type : Tape & Reel Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Assembly Type : PCB Mount Receptacle Sealable : No Termination Features Termination Method to Printed Circuit Board : Surface Mount - Solder Ball Usage Conditions Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]

Body Features


  • Primary Product Color : Natural

Configuration Features


  • Board-to-Board Configuration : Parallel
  • Number of Positions : 114
  • Number of Rows : 6
  • PCB Mount Orientation : Vertical
  • Stackable : Yes

Contact Features


  • Contact Base Material : Beryllium Copper
  • Contact Current Rating (Max) (AMP) : 1.5
  • Contact Layout : Matrix
  • Contact Mating Area Plating Material : Gold
  • Contact Mating Area Plating Material Finish : Bright
  • Contact Mating Area Plating Material Thickness : .76 MICM  [29.9212 MICIN ]
  • Contact Shape & Form : Square
  • Contact Type : Socket
  • Contact Underplating Material : Nickel
  • Mating Tab Thickness : .46 MM  [.018 INCH ]
  • Mating Tab Width : .43 MM  [.017 INCH ]

Dimensions


  • Connector Height : 8 MM  [.314 INCH ]
  • PCB Thickness (Recommended) : 2.36 MM  [.093 INCH ]
  • Row-to-Row Spacing : 1.27 MM  [.05 INCH ]
  • Stack Height : 12 MM  [.472 INCH ]

Electrical Characteristics


  • Dielectric Withstanding Voltage (Max) (VAC) : 750
  • Operating Voltage (VAC) : 250

Housing Features


  • Centerline (Pitch) : 1.27 MM  [.05 INCH ]
  • Housing Material : LCP (Liquid Crystal Polymer)
  • Mating Entry Location : Top

Industry Standards


  • Industry Standard : VITA 61

Mechanical Attachment


  • Connector Mounting Type : Board Mount
  • Mating Alignment : With
  • Mating Alignment Type : Polarizing Tab
  • PCB Mount Alignment : Without
  • PCB Mount Alignment Type : None
  • PCB Mount Retention : Without
  • PCB Mount Retention Type : Solder Ball

Operation/Application


  • Assembly Process Feature : Pick and Place Cover
  • Circuit Application : Signal

Packaging Features


  • Packaging Quantity : 350
  • Packaging Type : Tape & Reel

Product Type Features


  • Connector & Contact Terminates To : Printed Circuit Board
  • Connector System : Board-to-Board
  • PCB Connector Assembly Type : PCB Mount Receptacle
  • Sealable : No

Termination Features


  • Termination Method to Printed Circuit Board : Surface Mount - Solder Ball

Usage Conditions


  • Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]
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Backplane Connectors - 2102061-8 - Powell Electronics, Inc.
Swedesboro, NJ, United States
Backplane Connectors
2102061-8
Backplane Connectors 2102061-8
Mezalok, Socket, 114 p, 12 mm, 30 Au, LF

Mezalok, Socket, 114 p, 12 mm, 30 Au, LF

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Technical Specifications

  TE Connectivity Powell Electronics, Inc.
Product Category IC Interconnect Components IC Interconnect Components
Product Number 2102061-8 2102061-8
Product Name PCB Headers & Receptacles Backplane Connectors
Product Type PCB Receptacles IC Socket
Mounting Board Mount
Voltage Rating 250 volts
Current Rating 1.5 amps
Dielectric Withstanding Voltage 0.7500 kilovolts
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