TE Connectivity SO DIMM Sockets 2040910-2

Description
Body Features Ejector Location : Both Ends Ejector Type : Standard Latch Material : High Temperature Thermoplastic Latch Plating Material : Tin Module Key Type : Offset Right Retention Post Location : Both Ends Configuration Features Module Orientation : Vertical Number of Bays : 2 Number of Keys : 1 Number of Positions : 200 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Tin Dimensions Row-to-Row Spacing : 8.6 MM  [.338 INCH ] Electrical Characteristics DRAM Voltage (V) : 1.8 Housing Features Centerline (Pitch) : .6 MM  [.024 INCH ] Housing Material : Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment Type : Standard Keying PCB Mount Retention : With PCB Mount Retention Type : Solder Tail Operation/Applicatio n Circuit Application : Power Packaging Features Packaging Method : Box, Tray Packaging Quantity : 24 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Cable-to-Board DRAM Type : Double Data Rate (DDR) 2 Signal Characteristics SGRAM Voltage (V) : 1.8 Termination Features Insertion Style : Cam-In Termination Method to PCB : Surface Mount Usage Conditions Operating Temperature Range : -55 - 85 DEGC  [-67 - 185 DEGF ]
  • SO DIMM Sockets - 2040910-2 - TE Connectivity
    TE Connectivity
  • Headers & Wire Housings - 2040910-2 - Powell Electronics, Inc.
    Powell Electronics, Inc.
Request a Quote
Description
Body Features Ejector Location : Both Ends Ejector Type : Standard Latch Material : High Temperature Thermoplastic Latch Plating Material : Tin Module Key Type : Offset Right Retention Post Location : Both Ends Configuration Features Module Orientation : Vertical Number of Bays : 2 Number of Keys : 1 Number of Positions : 200 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Tin Dimensions Row-to-Row Spacing : 8.6 MM  [.338 INCH ] Electrical Characteristics DRAM Voltage (V) : 1.8 Housing Features Centerline (Pitch) : .6 MM  [.024 INCH ] Housing Material : Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment Type : Standard Keying PCB Mount Retention : With PCB Mount Retention Type : Solder Tail Operation/Applicatio n Circuit Application : Power Packaging Features Packaging Method : Box, Tray Packaging Quantity : 24 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Cable-to-Board DRAM Type : Double Data Rate (DDR) 2 Signal Characteristics SGRAM Voltage (V) : 1.8 Termination Features Insertion Style : Cam-In Termination Method to PCB : Surface Mount Usage Conditions Operating Temperature Range : -55 - 85 DEGC  [-67 - 185 DEGF ]
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
SO DIMM Sockets - 2040910-2 - TE Connectivity
TE Connectivity
Berwyn, PA, United States
SO DIMM Sockets
2040910-2
SO DIMM Sockets 2040910-2
Body Features Ejector Location : Both Ends Ejector Type : Standard Latch Material : High Temperature Thermoplastic Latch Plating Material : Tin Module Key Type : Offset Right Retention Post Location : Both Ends Configuration Features Module Orientation : Vertical Number of Bays : 2 Number of Keys : 1 Number of Positions : 200 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Tin Dimensions Row-to-Row Spacing : 8.6 MM  [.338 INCH ] Electrical Characteristics DRAM Voltage (V) : 1.8 Housing Features Centerline (Pitch) : .6 MM  [.024 INCH ] Housing Material : Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment Type : Standard Keying PCB Mount Retention : With PCB Mount Retention Type : Solder Tail Operation/Applicatio n Circuit Application : Power Packaging Features Packaging Method : Box, Tray Packaging Quantity : 24 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Cable-to-Board DRAM Type : Double Data Rate (DDR) 2 Signal Characteristics SGRAM Voltage (V) : 1.8 Termination Features Insertion Style : Cam-In Termination Method to PCB : Surface Mount Usage Conditions Operating Temperature Range : -55 - 85 DEGC  [-67 - 185 DEGF ]

Body Features


  • Ejector Location : Both Ends
  • Ejector Type : Standard
  • Latch Material : High Temperature Thermoplastic
  • Latch Plating Material : Tin
  • Module Key Type : Offset Right
  • Retention Post Location : Both Ends

Configuration Features


  • Module Orientation : Vertical
  • Number of Bays : 2
  • Number of Keys : 1
  • Number of Positions : 200
  • Number of Rows : 2

Contact Features


  • Contact Base Material : Copper Alloy
  • Contact Current Rating (Max) (AMP) : .5
  • Contact Mating Area Plating Material : Gold
  • Memory Socket Type : Memory Card
  • PCB Contact Termination Area Plating Material : Tin

Dimensions


  • Row-to-Row Spacing : 8.6 MM  [.338 INCH ]

Electrical Characteristics


  • DRAM Voltage (V) : 1.8

Housing Features


  • Centerline (Pitch) : .6 MM  [.024 INCH ]
  • Housing Material : Thermoplastic

Industry Standards


  • UL Flammability Rating : UL 94V-0

Mechanical Attachment


  • Connector Mounting Type : Board Mount
  • Mating Alignment Type : Standard Keying
  • PCB Mount Retention : With
  • PCB Mount Retention Type : Solder Tail

Operation/Application


  • Circuit Application : Power

Packaging Features


  • Packaging Method : Box, Tray
  • Packaging Quantity : 24

Product Type Features


  • Connector & Contact Terminates To : Printed Circuit Board
  • Connector System : Cable-to-Board
  • DRAM Type : Double Data Rate (DDR) 2

Signal Characteristics


  • SGRAM Voltage (V) : 1.8

Termination Features


  • Insertion Style : Cam-In
  • Termination Method to PCB : Surface Mount

Usage Conditions


  • Operating Temperature Range : -55 - 85 DEGC  [-67 - 185 DEGF ]
Buy Now
Headers & Wire Housings - 2040910-2 - Powell Electronics, Inc.
Powell Electronics, Inc.
Swedesboro, NJ, United States
Headers & Wire Housings
2040910-2
Headers & Wire Housings 2040910-2
SEMI-HARD TRAY ASSY DDR2 200P VERTICAL

SEMI-HARD TRAY ASSY DDR2 200P VERTICAL

Buy Now

Technical Specifications

  TE Connectivity Powell Electronics, Inc.
Product Category IC Interconnect Components IC Interconnect Components
Product Number 2040910-2 2040910-2
Product Name SO DIMM Sockets Headers & Wire Housings
Product Type IC Socket IC Headers
Socket Type DIMM
Mounting SMT; Board Mount
Voltage Rating 1.8 volts
Current Rating 0.5000 amps
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