TE Connectivity SO DIMM Sockets 2013290-2

Body Features

• Connector Profile : Reverse
• Ejector Location : Both Ends
• Ejector Type : Locking
• Latch Material : Stainless Steel
• Latch Plating Material : Tin
• Module Key Type : SGRAM

Configuration Features

• Module Orientation : Right Angle
• Number of Bays : 2
• Number of Keys : 1
• Number of Positions : 204
• Number of Rows : 2

Contact Features

• Contact Base Material : Copper Alloy
• Contact Current Rating (Max) (AMP) : .5
• Contact Mating Area Plating Material : Gold (Au)
• Contact Mating Area Plating Material Thickness : .254 MICM  [10 MICIN ]
• Memory Socket Type : Memory Card
• PCB Contact Termination Area Plating Material : Gold

Dimensions

• Row-to-Row Spacing : 8.2 MM  [.322 INCH ]
• Stack Height : 5.2 MM  [.205 INCH ]

Electrical Characteristics

• DRAM Voltage (V) : 1.5

Housing Features

• Centerline (Pitch) : .6 MM  [.024 INCH ]
• Housing Color : Black
• Housing Material : High Temperature Thermoplastic

Industry Standards

• UL Flammability Rating : UL 94V-0

Mechanical Attachment

• Connector Mounting Type : Board Mount
• Mating Alignment Type : Reverse Keying
• PCB Mount Retention : With
• PCB Mount Retention Type : Solder Peg

Operation/Application

• Circuit Application : Power

Packaging Features

• Packaging Method : Semi-Hard Tray Assembly
• Packaging Quantity : 20

Product Type Features

• Connector & Contact Terminates To : Printed Circuit Board
• Connector System : Cable-to-Board
• DRAM Type : Double Data Rate (DDR) 3

Signal Characteristics

• SGRAM Voltage (V) : 1.5

Termination Features

• Insertion Style : Cam-In
• Termination Method to PCB : Surface Mount

Usage Conditions

• Operating Temperature Range : -55 - 85 DEGC  [-67 - 185 DEGF ]

SEMI-HARD TRAY DDR3 204P 5.2H RVS Au0.25