TE Connectivity DIMM Sockets 2013266-6

Description
Body Features Ejector Location : Both Ends Ejector Material : High Temperature Thermoplastic Ejector Material Color : Natural Ejector Type : Standard Latch Color : Natural Latch Material : High Temperature Thermoplastic Module Key Type : Offset Left Retention Post Location : Both Ends Configuration Features Center Key : Offset Left Keying : Standard Module Orientation : Vertical Number of Bays : 2 Number of Keys : 1 Number of Positions : 240 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Thickness : .76 MICM  [30 MICIN ] Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin Socket Style : DIMM Socket Type : Memory Card Solder Tail Contact Plating Thickness : 2.54 MICM  [100 MICIN ] Dimensions Center Retention Hole Diameter : 1.8 MM  [.07 INCH ] Height Above PC Board : 23.1 MM  [.9 INCH ] Row-to-Row Spacing : 1.9 MM  [.075 INCH ] Electrical Characteristics DRAM Voltage (V) : 1.5 Housing Features Centerline (Pitch) : 1 MM  [.039 INCH ] Housing Color : Natural Housing Material : High Temperature Nylon Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Locating Posts : With Mounting Angle : Vertical PCB Mount Retention : With PCB Mount Retention Type : Solder Tail PCB Mounting Style : Through Hole - Press-Fit Polarization : Left Operation/Applicatio n Circuit Application : Signal Other Comment : With LED Position. Packaging Features Packaging Method : Box & Tray, Tray Packaging Quantity : 64 Product Type Features Center Post : Without Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board DRAM Type : Double Data Rate (DDR) 3 Product Type : Socket Sealable : No Termination Features Insertion Style : Direct Insert Termination Post Length : 3.38 MM  [.133 INCH ] Usage Conditions Operating Temperature Range : -55 - 85 DEGC  [-67 - 185 DEGF ]
  • DIMM Sockets - 2013266-6 - TE Connectivity
    TE Connectivity
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Description
Body Features Ejector Location : Both Ends Ejector Material : High Temperature Thermoplastic Ejector Material Color : Natural Ejector Type : Standard Latch Color : Natural Latch Material : High Temperature Thermoplastic Module Key Type : Offset Left Retention Post Location : Both Ends Configuration Features Center Key : Offset Left Keying : Standard Module Orientation : Vertical Number of Bays : 2 Number of Keys : 1 Number of Positions : 240 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Thickness : .76 MICM  [30 MICIN ] Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin Socket Style : DIMM Socket Type : Memory Card Solder Tail Contact Plating Thickness : 2.54 MICM  [100 MICIN ] Dimensions Center Retention Hole Diameter : 1.8 MM  [.07 INCH ] Height Above PC Board : 23.1 MM  [.9 INCH ] Row-to-Row Spacing : 1.9 MM  [.075 INCH ] Electrical Characteristics DRAM Voltage (V) : 1.5 Housing Features Centerline (Pitch) : 1 MM  [.039 INCH ] Housing Color : Natural Housing Material : High Temperature Nylon Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Locating Posts : With Mounting Angle : Vertical PCB Mount Retention : With PCB Mount Retention Type : Solder Tail PCB Mounting Style : Through Hole - Press-Fit Polarization : Left Operation/Applicatio n Circuit Application : Signal Other Comment : With LED Position. Packaging Features Packaging Method : Box & Tray, Tray Packaging Quantity : 64 Product Type Features Center Post : Without Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board DRAM Type : Double Data Rate (DDR) 3 Product Type : Socket Sealable : No Termination Features Insertion Style : Direct Insert Termination Post Length : 3.38 MM  [.133 INCH ] Usage Conditions Operating Temperature Range : -55 - 85 DEGC  [-67 - 185 DEGF ]
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Suppliers

Company
Product
Description
Supplier Links
DIMM Sockets - 2013266-6 - TE Connectivity
TE Connectivity
Berwyn, PA, United States
DIMM Sockets
2013266-6
DIMM Sockets 2013266-6
Body Features Ejector Location : Both Ends Ejector Material : High Temperature Thermoplastic Ejector Material Color : Natural Ejector Type : Standard Latch Color : Natural Latch Material : High Temperature Thermoplastic Module Key Type : Offset Left Retention Post Location : Both Ends Configuration Features Center Key : Offset Left Keying : Standard Module Orientation : Vertical Number of Bays : 2 Number of Keys : 1 Number of Positions : 240 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Thickness : .76 MICM  [30 MICIN ] Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin Socket Style : DIMM Socket Type : Memory Card Solder Tail Contact Plating Thickness : 2.54 MICM  [100 MICIN ] Dimensions Center Retention Hole Diameter : 1.8 MM  [.07 INCH ] Height Above PC Board : 23.1 MM  [.9 INCH ] Row-to-Row Spacing : 1.9 MM  [.075 INCH ] Electrical Characteristics DRAM Voltage (V) : 1.5 Housing Features Centerline (Pitch) : 1 MM  [.039 INCH ] Housing Color : Natural Housing Material : High Temperature Nylon Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Locating Posts : With Mounting Angle : Vertical PCB Mount Retention : With PCB Mount Retention Type : Solder Tail PCB Mounting Style : Through Hole - Press-Fit Polarization : Left Operation/Applicatio n Circuit Application : Signal Other Comment : With LED Position. Packaging Features Packaging Method : Box & Tray, Tray Packaging Quantity : 64 Product Type Features Center Post : Without Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board DRAM Type : Double Data Rate (DDR) 3 Product Type : Socket Sealable : No Termination Features Insertion Style : Direct Insert Termination Post Length : 3.38 MM  [.133 INCH ] Usage Conditions Operating Temperature Range : -55 - 85 DEGC  [-67 - 185 DEGF ]

Body Features


  • Ejector Location : Both Ends
  • Ejector Material : High Temperature Thermoplastic
  • Ejector Material Color : Natural
  • Ejector Type : Standard
  • Latch Color : Natural
  • Latch Material : High Temperature Thermoplastic
  • Module Key Type : Offset Left
  • Retention Post Location : Both Ends

Configuration Features


  • Center Key : Offset Left
  • Keying : Standard
  • Module Orientation : Vertical
  • Number of Bays : 2
  • Number of Keys : 1
  • Number of Positions : 240
  • Number of Rows : 2

Contact Features


  • Contact Base Material : Copper Alloy
  • Contact Current Rating (Max) (AMP) : .5
  • Contact Mating Area Plating Material : Gold
  • Contact Mating Area Plating Thickness : .76 MICM  [30 MICIN ]
  • Contact Underplating Material : Nickel
  • PCB Contact Termination Area Plating Material : Tin
  • Socket Style : DIMM
  • Socket Type : Memory Card
  • Solder Tail Contact Plating Thickness : 2.54 MICM  [100 MICIN ]

Dimensions


  • Center Retention Hole Diameter : 1.8 MM  [.07 INCH ]
  • Height Above PC Board : 23.1 MM  [.9 INCH ]
  • Row-to-Row Spacing : 1.9 MM  [.075 INCH ]

Electrical Characteristics


  • DRAM Voltage (V) : 1.5

Housing Features


  • Centerline (Pitch) : 1 MM  [.039 INCH ]
  • Housing Color : Natural
  • Housing Material : High Temperature Nylon

Industry Standards


  • UL Flammability Rating : UL 94V-0

Mechanical Attachment


  • Connector Mounting Type : Board Mount
  • Locating Posts : With
  • Mounting Angle : Vertical
  • PCB Mount Retention : With
  • PCB Mount Retention Type : Solder Tail
  • PCB Mounting Style : Through Hole - Press-Fit
  • Polarization : Left

Operation/Application


  • Circuit Application : Signal

Other


  • Comment : With LED Position.

Packaging Features


  • Packaging Method : Box & Tray, Tray
  • Packaging Quantity : 64

Product Type Features


  • Center Post : Without
  • Connector & Contact Terminates To : Printed Circuit Board
  • Connector System : Board-to-Board
  • DRAM Type : Double Data Rate (DDR) 3
  • Product Type : Socket
  • Sealable : No

Termination Features


  • Insertion Style : Direct Insert
  • Termination Post Length : 3.38 MM  [.133 INCH ]

Usage Conditions


  • Operating Temperature Range : -55 - 85 DEGC  [-67 - 185 DEGF ]
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Technical Specifications

  TE Connectivity
Product Category IC Interconnect Components
Product Number 2013266-6
Product Name DIMM Sockets
Product Type IC Socket
Socket Type DIMM
Mounting Board Mount
Voltage Rating 1.5 volts
Current Rating 0.5000 amps
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