TE Connectivity Board-to-Board Headers & Receptacles 2007615-5

Description
Configuration Features Board-to-Board Configuration : Parallel Number of Positions : 200 Number of Rows : 18 PCB Mount Orientation : Vertical Stackable : Yes Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1 Contact Layout : Matrix Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .76 MICM  [29.9212 MICIN ] Contact Shape & Form : Dual Beam, Single Beam Contact Type : Socket Mating Tab Thickness : .2 MM  [.008 INCH ] Mating Tab Width : 1 MM  [.039 INCH ] PCB Contact Termination Area Plating Material : Tin-Lead Dimensions Connector Height : 10.65 MM  [.418545 INCH ] PCB Thickness (Recommended) : 1.57 MM  [.8 INCH ] Row-to-Row Spacing : 2 MM  [.0786 INCH ] Stack Height : 18 MM , 17 MM , 15 MM , 20 MM , 25 MM , 30 MM  [1.181 INCH ] Electrical Characteristics Dielectric Withstanding Voltage (Max) (VDC) : 500 Insulation Resistance (MEGO) : 18 Operating Voltage (VAC) : 48 Housing Features Centerline (Pitch) : 1.3 MM  [.051 INCH ] Housing Color : Natural Housing Material : Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : Without Mating Retention : With PCB Mount Alignment : Without PCB Mount Retention : Without Operation/Applicatio n Assembly Process Feature : None Circuit Application : Power & Signal Packaging Features Packaging Method : Tray Packaging Quantity : 28 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Assembly Type : PCB Mount Receptacle Sealable : No Termination Features Termination Method to Printed Circuit Board : Surface Mount - Solder Ball Usage Conditions Operating Temperature Range : 0 - 100 DEGC  [32 - 212 DEGF ]
  • Board-to-Board Headers & Receptacles - 2007615-5 - TE Connectivity
    TE Connectivity
  • Step-Z Rcpt 05Mm 200P Pb Ht Amp - Te Connectivity - 75AC6810 - Newark, An Avnet Company
    Newark, An Avnet Company
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Description
Configuration Features Board-to-Board Configuration : Parallel Number of Positions : 200 Number of Rows : 18 PCB Mount Orientation : Vertical Stackable : Yes Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1 Contact Layout : Matrix Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .76 MICM  [29.9212 MICIN ] Contact Shape & Form : Dual Beam, Single Beam Contact Type : Socket Mating Tab Thickness : .2 MM  [.008 INCH ] Mating Tab Width : 1 MM  [.039 INCH ] PCB Contact Termination Area Plating Material : Tin-Lead Dimensions Connector Height : 10.65 MM  [.418545 INCH ] PCB Thickness (Recommended) : 1.57 MM  [.8 INCH ] Row-to-Row Spacing : 2 MM  [.0786 INCH ] Stack Height : 18 MM , 17 MM , 15 MM , 20 MM , 25 MM , 30 MM  [1.181 INCH ] Electrical Characteristics Dielectric Withstanding Voltage (Max) (VDC) : 500 Insulation Resistance (MEGO) : 18 Operating Voltage (VAC) : 48 Housing Features Centerline (Pitch) : 1.3 MM  [.051 INCH ] Housing Color : Natural Housing Material : Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : Without Mating Retention : With PCB Mount Alignment : Without PCB Mount Retention : Without Operation/Applicatio n Assembly Process Feature : None Circuit Application : Power & Signal Packaging Features Packaging Method : Tray Packaging Quantity : 28 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Assembly Type : PCB Mount Receptacle Sealable : No Termination Features Termination Method to Printed Circuit Board : Surface Mount - Solder Ball Usage Conditions Operating Temperature Range : 0 - 100 DEGC  [32 - 212 DEGF ]
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Suppliers

Company
Product
Description
Supplier Links
Board-to-Board Headers & Receptacles - 2007615-5 - TE Connectivity
TE Connectivity
Berwyn, PA, United States
Board-to-Board Headers & Receptacles
2007615-5
Board-to-Board Headers & Receptacles 2007615-5
Configuration Features Board-to-Board Configuration : Parallel Number of Positions : 200 Number of Rows : 18 PCB Mount Orientation : Vertical Stackable : Yes Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1 Contact Layout : Matrix Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .76 MICM  [29.9212 MICIN ] Contact Shape & Form : Dual Beam, Single Beam Contact Type : Socket Mating Tab Thickness : .2 MM  [.008 INCH ] Mating Tab Width : 1 MM  [.039 INCH ] PCB Contact Termination Area Plating Material : Tin-Lead Dimensions Connector Height : 10.65 MM  [.418545 INCH ] PCB Thickness (Recommended) : 1.57 MM  [.8 INCH ] Row-to-Row Spacing : 2 MM  [.0786 INCH ] Stack Height : 18 MM , 17 MM , 15 MM , 20 MM , 25 MM , 30 MM  [1.181 INCH ] Electrical Characteristics Dielectric Withstanding Voltage (Max) (VDC) : 500 Insulation Resistance (MEGO) : 18 Operating Voltage (VAC) : 48 Housing Features Centerline (Pitch) : 1.3 MM  [.051 INCH ] Housing Color : Natural Housing Material : Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : Without Mating Retention : With PCB Mount Alignment : Without PCB Mount Retention : Without Operation/Applicatio n Assembly Process Feature : None Circuit Application : Power & Signal Packaging Features Packaging Method : Tray Packaging Quantity : 28 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Assembly Type : PCB Mount Receptacle Sealable : No Termination Features Termination Method to Printed Circuit Board : Surface Mount - Solder Ball Usage Conditions Operating Temperature Range : 0 - 100 DEGC  [32 - 212 DEGF ]

Configuration Features


  • Board-to-Board Configuration : Parallel
  • Number of Positions : 200
  • Number of Rows : 18
  • PCB Mount Orientation : Vertical
  • Stackable : Yes

Contact Features


  • Contact Base Material : Copper Alloy
  • Contact Current Rating (Max) (AMP) : 1
  • Contact Layout : Matrix
  • Contact Mating Area Plating Material : Gold
  • Contact Mating Area Plating Material Thickness : .76 MICM  [29.9212 MICIN ]
  • Contact Shape & Form : Dual Beam, Single Beam
  • Contact Type : Socket
  • Mating Tab Thickness : .2 MM  [.008 INCH ]
  • Mating Tab Width : 1 MM  [.039 INCH ]
  • PCB Contact Termination Area Plating Material : Tin-Lead

Dimensions


  • Connector Height : 10.65 MM  [.418545 INCH ]
  • PCB Thickness (Recommended) : 1.57 MM  [.8 INCH ]
  • Row-to-Row Spacing : 2 MM  [.0786 INCH ]
  • Stack Height : 18 MM , 17 MM , 15 MM , 20 MM , 25 MM , 30 MM  [1.181 INCH ]

Electrical Characteristics


  • Dielectric Withstanding Voltage (Max) (VDC) : 500
  • Insulation Resistance (MEGO) : 18
  • Operating Voltage (VAC) : 48

Housing Features


  • Centerline (Pitch) : 1.3 MM  [.051 INCH ]
  • Housing Color : Natural
  • Housing Material : Thermoplastic

Industry Standards


  • UL Flammability Rating : UL 94V-0

Mechanical Attachment


  • Connector Mounting Type : Board Mount
  • Mating Alignment : Without
  • Mating Retention : With
  • PCB Mount Alignment : Without
  • PCB Mount Retention : Without

Operation/Application


  • Assembly Process Feature : None
  • Circuit Application : Power & Signal

Packaging Features


  • Packaging Method : Tray
  • Packaging Quantity : 28

Product Type Features


  • Connector & Contact Terminates To : Printed Circuit Board
  • Connector System : Board-to-Board
  • PCB Connector Assembly Type : PCB Mount Receptacle
  • Sealable : No

Termination Features


  • Termination Method to Printed Circuit Board : Surface Mount - Solder Ball

Usage Conditions


  • Operating Temperature Range : 0 - 100 DEGC  [32 - 212 DEGF ]
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Shenzhen Shengyu Electronics Technology Limited
Futian, China
Connectors, Interconnects - Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)
2007615-5
Connectors, Interconnects - Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) 2007615-5
CONN DIFF ARRAY RCPT 200POS SMD

CONN DIFF ARRAY RCPT 200POS SMD

Supplier's Site
Step-Z Rcpt 05Mm 200P Pb Ht Amp - Te Connectivity - 75AC6810 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Step-Z Rcpt 05Mm 200P Pb Ht Amp - Te Connectivity
75AC6810
Step-Z Rcpt 05Mm 200P Pb Ht Amp - Te Connectivity 75AC6810
STEP-Z RCPT 05MM 200P PB HT

STEP-Z RCPT 05MM 200P PB HT

Supplier's Site

Technical Specifications

  TE Connectivity Shenzhen Shengyu Electronics Technology Limited Newark, An Avnet Company
Product Category Electrical Connectors Electrical Connectors Electrical Connectors
Product Number 2007615-5 2007615-5 75AC6810
Product Name Board-to-Board Headers & Receptacles Connectors, Interconnects - Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) Step-Z Rcpt 05Mm 200P Pb Ht Amp - Te Connectivity
Connector Type Board to Board Connector Rectangular Connectors, Heavy Duty
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