TE Connectivity Board Level Pressure Sensors 20001149-00

Description
Dimensions Dimensions : 3.3 x 3.3 x 2.75 MM  [.11 x .11 x 0.03 INCH ] Electrical Characteristics Board Level Pressure Sensor Supply Voltage (V) : 1.5 - 3.6 Operation/Applicatio n Board Level Pressure Sensor Accuracy : ±1.5mbar Output Interface : I2C Output/Span : 24 bit ADC Pressure (MBAR) : 30000 Proof Pressure Range : 50 bar Resolution : .2 Other Options : High Endurance, Shielded Packaging Features Board Level Pressure Sensor Package : Surface Mountable Product Type Features Board Level Pressure Sensor Style : Absolute Board Level Pressure Sensor Type : Digital Pressure and Altimeter Sensor Modules Usage Conditions Operating Temperature Range : -20 - 85 DEGC  [-4 - 186 DEGF ] Pressure (BAR) : 30
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Description
Dimensions Dimensions : 3.3 x 3.3 x 2.75 MM  [.11 x .11 x 0.03 INCH ] Electrical Characteristics Board Level Pressure Sensor Supply Voltage (V) : 1.5 - 3.6 Operation/Applicatio n Board Level Pressure Sensor Accuracy : ±1.5mbar Output Interface : I2C Output/Span : 24 bit ADC Pressure (MBAR) : 30000 Proof Pressure Range : 50 bar Resolution : .2 Other Options : High Endurance, Shielded Packaging Features Board Level Pressure Sensor Package : Surface Mountable Product Type Features Board Level Pressure Sensor Style : Absolute Board Level Pressure Sensor Type : Digital Pressure and Altimeter Sensor Modules Usage Conditions Operating Temperature Range : -20 - 85 DEGC  [-4 - 186 DEGF ] Pressure (BAR) : 30
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Suppliers

Company
Product
Description
Supplier Links
Board Level Pressure Sensors - 20001149-00 - TE Connectivity
Berwyn, PA, United States
Board Level Pressure Sensors
20001149-00
Board Level Pressure Sensors 20001149-00
Dimensions Dimensions : 3.3 x 3.3 x 2.75 MM  [.11 x .11 x 0.03 INCH ] Electrical Characteristics Board Level Pressure Sensor Supply Voltage (V) : 1.5 - 3.6 Operation/Applicatio n Board Level Pressure Sensor Accuracy : ±1.5mbar Output Interface : I2C Output/Span : 24 bit ADC Pressure (MBAR) : 30000 Proof Pressure Range : 50 bar Resolution : .2 Other Options : High Endurance, Shielded Packaging Features Board Level Pressure Sensor Package : Surface Mountable Product Type Features Board Level Pressure Sensor Style : Absolute Board Level Pressure Sensor Type : Digital Pressure and Altimeter Sensor Modules Usage Conditions Operating Temperature Range : -20 - 85 DEGC  [-4 - 186 DEGF ] Pressure (BAR) : 30

Dimensions


  • Dimensions : 3.3 x 3.3 x 2.75 MM  [.11 x .11 x 0.03 INCH ]

Electrical Characteristics


  • Board Level Pressure Sensor Supply Voltage (V) : 1.5 - 3.6

Operation/Application


  • Board Level Pressure Sensor Accuracy : ±1.5mbar
  • Output Interface : I2C
  • Output/Span : 24 bit ADC
  • Pressure (MBAR) : 30000
  • Proof Pressure Range : 50 bar
  • Resolution : .2

Other


  • Options : High Endurance, Shielded

Packaging Features


  • Board Level Pressure Sensor Package : Surface Mountable

Product Type Features


  • Board Level Pressure Sensor Style : Absolute
  • Board Level Pressure Sensor Type : Digital Pressure and Altimeter Sensor Modules

Usage Conditions


  • Operating Temperature Range : -20 - 85 DEGC  [-4 - 186 DEGF ]
  • Pressure (BAR) : 30
Buy Now
Downers Grove, IL, United States
Pressure Sensors
20001149-00
Pressure Sensors 20001149-00
MS5837-30BA Pressure Sensor Ultra-small, gel-filled, pressure sensor withstainless steel cap The MS5837-30BA is a high-resolution pressure and temperature sensorfrom TE Connectivity (TE) with I2C bus interface. This sensor is optimizedfor water depth measurement systems with a resolution of 0.2 cm. Thesensor module includes a high linearity pressure sensor and an ultra-lowpower 24-bit delta sigma ADC with internal factory calibrated coefficients. Itprovides a precise digital 24-bit pressure and temperature value anddifferent operation modes that allow the user to optimize for conversionspeed and current consumption. A high-resolution temperature outputallows the implementation in depth measurement systems andthermometer function without any additional sensor. The MS5807-30BAcan be interfaced to virtually any microcontroller. The communicationprotoco l is simple, without the need of programming internal registers in thedevice. The gel protection and antimagnetic stainless-steel cap make themodule water resistant. Small dimensions of only 3.3 x 3.3 x 2.75 mm allow integration in mobiledevices. Enhanced construction and design materials allow for enhancedchemical endurance in applications with harsh liquid media environmentswith limited exposure. This sensor module generation is based on leadingMEMS technology from TE proven experience and know-how in highvolume manufacturing of sensors modules. Features Ceramic and metal package: 3.3 x 3.3 x 2.75mm High resolution module: 0.2 cm (in water) Supply voltage: 1.5 to 3.6 V Low power: 0.6 uA (standby <= 0.1 uA at 25 C) Integrated digital pressure sensor Operating range: 0 to 30 mbar, -20 to +85 C I2C interface No external components (internal oscillator) Water resistant sealing with 1.8 x 0.8mm O-ring High chemical endurance Shielded metal lid Applications Dive Computers Mobile Water Depth Measurement Systems Fitness Trackers Wearables

MS5837-30BA Pressure Sensor

Ultra-small, gel-filled, pressure sensor withstainless steel cap

The MS5837-30BA is a high-resolution pressure and temperature sensorfrom TE Connectivity (TE) with I2C bus interface. This sensor is optimizedfor water depth measurement systems with a resolution of 0.2 cm. Thesensor module includes a high linearity pressure sensor and an ultra-lowpower 24-bit delta sigma ADC with internal factory calibrated coefficients. Itprovides a precise digital 24-bit pressure and temperature value anddifferent operation modes that allow the user to optimize for conversionspeed and current consumption. A high-resolution temperature outputallows the implementation in depth measurement systems andthermometer function without any additional sensor. The MS5807-30BAcan be interfaced to virtually any microcontroller. The communicationprotocol is simple, without the need of programming internal registers in thedevice. The gel protection and antimagnetic stainless-steel cap make themodule water resistant.

Small dimensions of only 3.3 x 3.3 x 2.75 mm allow integration in mobiledevices. Enhanced construction and design materials allow for enhancedchemical endurance in applications with harsh liquid media environmentswith limited exposure. This sensor module generation is based on leadingMEMS technology from TE proven experience and know-how in highvolume manufacturing of sensors modules.

Features

  • Ceramic and metal package: 3.3 x 3.3 x 2.75mm
  • High resolution module: 0.2 cm (in water)
  • Supply voltage: 1.5 to 3.6 V
  • Low power: 0.6 uA (standby <= 0.1 uA at 25 C)
  • Integrated digital pressure sensor
  • Operating range: 0 to 30 mbar, -20 to +85 C
  • I2C interface
  • No external components (internal oscillator)
  • Water resistant sealing with 1.8 x 0.8mm O-ring
  • High chemical endurance
  • Shielded metal lid

Applications

  • Dive Computers
  • Mobile Water Depth Measurement Systems
  • Fitness Trackers
  • Wearables
Supplier's Site Datasheet

Technical Specifications

  TE Connectivity Richardson RFPD
Product Category Pressure Sensors Pressure Sensors
Product Number 20001149-00 20001149-00
Product Name Board Level Pressure Sensors Pressure Sensors
Device Category Sensor Sensor
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