TE Connectivity ™ Socket, DIP;Dual Leaf;28 Pos.;0.100In.cen.;Thru Hole;0.610In.;Phosphor Bronze;Ti 2-641615-3

Description
DIP Sockets, Phosphor Bronze Contact Material, +105°C Operating Temperature Thru hole mounting type Wave solder capable to 240°C Glass-filled thermoplastic housing material Solder Tail Dual Leaf (DL) Sockets Dual Wiping Contacts Face Wipe Contacts for High Reliability and Constant, Low Resistance Stackable End-to-End and Side-to-Side (Brickwalling) for High Board Density Housing Standoffs and Slots Facilitate Board Cleaning Retention Style Tails or Straight Solder Tails Designed for Automatic Machine Insertion - DIP-to-Socket or Socket-to-Board (Tube Loaded) Housing: Glass-Filled Thermoplastic, 94 V-0 Rated, Black Contacts: Phosphor Bronze or Beryllium Copper with Tin or Gold Plating
Description
DIP Sockets, Phosphor Bronze Contact Material, +105°C Operating Temperature Thru hole mounting type Wave solder capable to 240°C Glass-filled thermoplastic housing material Solder Tail Dual Leaf (DL) Sockets Dual Wiping Contacts Face Wipe Contacts for High Reliability and Constant, Low Resistance Stackable End-to-End and Side-to-Side (Brickwalling) for High Board Density Housing Standoffs and Slots Facilitate Board Cleaning Retention Style Tails or Straight Solder Tails Designed for Automatic Machine Insertion - DIP-to-Socket or Socket-to-Board (Tube Loaded) Housing: Glass-Filled Thermoplastic, 94 V-0 Rated, Black Contacts: Phosphor Bronze or Beryllium Copper with Tin or Gold Plating

Suppliers

Company
Product
Description
Supplier Links
Socket, DIP;Dual Leaf;28 Pos.;0.100In.cen.;Thru Hole;0.610In.;Phosphor Bronze;Ti - 70084200 - Allied Electronics, Inc.
Fort Worth, TX, USA
Socket, DIP;Dual Leaf;28 Pos.;0.100In.cen.;Thru Hole;0.610In.;Phosphor Bronze;Ti
70084200
Socket, DIP;Dual Leaf;28 Pos.;0.100In.cen.;Thru Hole;0.610In.;Phosphor Bronze;Ti 70084200
DIP Sockets, Phosphor Bronze Contact Material, +105°C Operating Temperature Thru hole mounting type Wave solder capable to 240°C Glass-filled thermoplastic housing material Solder Tail Dual Leaf (DL) Sockets Dual Wiping Contacts Face Wipe Contacts for High Reliability and Constant, Low Resistance Stackable End-to-End and Side-to-Side (Brickwalling) for High Board Density Housing Standoffs and Slots Facilitate Board Cleaning Retention Style Tails or Straight Solder Tails Designed for Automatic Machine Insertion - DIP-to-Socket or Socket-to-Board (Tube Loaded) Housing: Glass-Filled Thermoplastic, 94 V-0 Rated, Black Contacts: Phosphor Bronze or Beryllium Copper with Tin or Gold Plating

DIP Sockets, Phosphor Bronze Contact Material, +105°C Operating Temperature

  • Thru hole mounting type
  • Wave solder capable to 240°C
  • Glass-filled thermoplastic housing material
  • Solder Tail Dual Leaf (DL) Sockets
  • Dual Wiping Contacts
  • Face Wipe Contacts for High Reliability and Constant, Low Resistance
  • Stackable End-to-End and Side-to-Side (Brickwalling) for High Board Density
  • Housing Standoffs and Slots Facilitate Board Cleaning
  • Retention Style Tails or Straight Solder Tails
  • Designed for Automatic Machine Insertion - DIP-to-Socket or Socket-to-Board (Tube Loaded)
  • Housing: Glass-Filled Thermoplastic, 94 V-0 Rated, Black
  • Contacts: Phosphor Bronze or Beryllium Copper with Tin or Gold Plating
Supplier's Site

Technical Specifications

  Allied Electronics, Inc.
Product Category IC Interconnect Components
Product Number 70084200
Product Name Socket, DIP;Dual Leaf;28 Pos.;0.100In.cen.;Thru Hole;0.610In.;Phosphor Bronze;Ti
Product Type IC Socket
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