TE Connectivity DIMM Sockets 2-2355626-1

Description
Body Features Connector Profile : Standard Ejector Location : Both Ends Ejector Material : High Temperature Nylon Ejector Material Color : Black Ejector Type : Rotary Latch Color : Black Latch Material : High Temperature Nylon Module Key Type : DRAM PCB Retention Feature Material : Stainless Steel Configuration Features Module Orientation : Vertical Number of Bays : 2 Number of Keys : 1 Number of Positions : 288 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1.5 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .76 MICM  [30 MICIN ] Contact Underplating Material : Nickel Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Tin PCB Contact Termination Area Plating Material Thickness : 3 MICM  [120 MICIN ] Socket Style : DIMM Dimensions Profile Height from PCB : 21.3 MM  [.083 INCH ] Row-to-Row Spacing : 3 MM  [.118 INCH ] Electrical Characteristics DRAM Voltage (V) : 1.1 Housing Features Centerline (Pitch) : .85 MM  [.033 INCH ] Housing Color : Black Housing Material : High Temperature Nylon Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : 1 Key Mount Angle : Vertical PCB Mount Retention Type : Tab Operation/Applicatio n Circuit Application : High Speed Data Packaging Features Packaging Method : Box & Tray Packaging Quantity : 640 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Component DRAM Type : Double Data Rate (DDR) 5 Termination Features Insertion Style : Direct Insert Termination Method to PCB : Surface Mount Termination Post & Tail Length : .89 MM  [.035 INCH ] Usage Conditions Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]
  • DIMM Sockets - 2-2355626-1 - TE Connectivity
    TE Connectivity
  • Connectors, Interconnects- Memory Connectors- Inline Module Sockets - Win Source Electronics
    Win Source Electronics
Request a Quote Datasheet
Description
Body Features Connector Profile : Standard Ejector Location : Both Ends Ejector Material : High Temperature Nylon Ejector Material Color : Black Ejector Type : Rotary Latch Color : Black Latch Material : High Temperature Nylon Module Key Type : DRAM PCB Retention Feature Material : Stainless Steel Configuration Features Module Orientation : Vertical Number of Bays : 2 Number of Keys : 1 Number of Positions : 288 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1.5 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .76 MICM  [30 MICIN ] Contact Underplating Material : Nickel Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Tin PCB Contact Termination Area Plating Material Thickness : 3 MICM  [120 MICIN ] Socket Style : DIMM Dimensions Profile Height from PCB : 21.3 MM  [.083 INCH ] Row-to-Row Spacing : 3 MM  [.118 INCH ] Electrical Characteristics DRAM Voltage (V) : 1.1 Housing Features Centerline (Pitch) : .85 MM  [.033 INCH ] Housing Color : Black Housing Material : High Temperature Nylon Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : 1 Key Mount Angle : Vertical PCB Mount Retention Type : Tab Operation/Applicatio n Circuit Application : High Speed Data Packaging Features Packaging Method : Box & Tray Packaging Quantity : 640 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Component DRAM Type : Double Data Rate (DDR) 5 Termination Features Insertion Style : Direct Insert Termination Method to PCB : Surface Mount Termination Post & Tail Length : .89 MM  [.035 INCH ] Usage Conditions Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]
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Suppliers

Company
Product
Description
Supplier Links
DIMM Sockets - 2-2355626-1 - TE Connectivity
TE Connectivity
Berwyn, PA, United States
DIMM Sockets
2-2355626-1
DIMM Sockets 2-2355626-1
Body Features Connector Profile : Standard Ejector Location : Both Ends Ejector Material : High Temperature Nylon Ejector Material Color : Black Ejector Type : Rotary Latch Color : Black Latch Material : High Temperature Nylon Module Key Type : DRAM PCB Retention Feature Material : Stainless Steel Configuration Features Module Orientation : Vertical Number of Bays : 2 Number of Keys : 1 Number of Positions : 288 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1.5 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .76 MICM  [30 MICIN ] Contact Underplating Material : Nickel Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Tin PCB Contact Termination Area Plating Material Thickness : 3 MICM  [120 MICIN ] Socket Style : DIMM Dimensions Profile Height from PCB : 21.3 MM  [.083 INCH ] Row-to-Row Spacing : 3 MM  [.118 INCH ] Electrical Characteristics DRAM Voltage (V) : 1.1 Housing Features Centerline (Pitch) : .85 MM  [.033 INCH ] Housing Color : Black Housing Material : High Temperature Nylon Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : 1 Key Mount Angle : Vertical PCB Mount Retention Type : Tab Operation/Applicatio n Circuit Application : High Speed Data Packaging Features Packaging Method : Box & Tray Packaging Quantity : 640 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Component DRAM Type : Double Data Rate (DDR) 5 Termination Features Insertion Style : Direct Insert Termination Method to PCB : Surface Mount Termination Post & Tail Length : .89 MM  [.035 INCH ] Usage Conditions Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]

Body Features


  • Connector Profile : Standard
  • Ejector Location : Both Ends
  • Ejector Material : High Temperature Nylon
  • Ejector Material Color : Black
  • Ejector Type : Rotary
  • Latch Color : Black
  • Latch Material : High Temperature Nylon
  • Module Key Type : DRAM
  • PCB Retention Feature Material : Stainless Steel

Configuration Features


  • Module Orientation : Vertical
  • Number of Bays : 2
  • Number of Keys : 1
  • Number of Positions : 288
  • Number of Rows : 2

Contact Features


  • Contact Base Material : Copper Alloy
  • Contact Current Rating (Max) (AMP) : 1.5
  • Contact Mating Area Plating Material : Gold (Au)
  • Contact Mating Area Plating Material Thickness : .76 MICM  [30 MICIN ]
  • Contact Underplating Material : Nickel
  • Memory Socket Type : Memory Card
  • PCB Contact Termination Area Plating Material : Tin
  • PCB Contact Termination Area Plating Material Thickness : 3 MICM  [120 MICIN ]
  • Socket Style : DIMM

Dimensions


  • Profile Height from PCB : 21.3 MM  [.083 INCH ]
  • Row-to-Row Spacing : 3 MM  [.118 INCH ]

Electrical Characteristics


  • DRAM Voltage (V) : 1.1

Housing Features


  • Centerline (Pitch) : .85 MM  [.033 INCH ]
  • Housing Color : Black
  • Housing Material : High Temperature Nylon

Industry Standards


  • UL Flammability Rating : UL 94V-0

Mechanical Attachment


  • Connector Mounting Type : Board Mount
  • Mating Alignment : With
  • Mating Alignment Type : 1 Key
  • Mount Angle : Vertical
  • PCB Mount Retention Type : Tab

Operation/Application


  • Circuit Application : High Speed Data

Packaging Features


  • Packaging Method : Box & Tray
  • Packaging Quantity : 640

Product Type Features


  • Connector & Contact Terminates To : Printed Circuit Board
  • Connector System : Board-to-Component
  • DRAM Type : Double Data Rate (DDR) 5

Termination Features


  • Insertion Style : Direct Insert
  • Termination Method to PCB : Surface Mount
  • Termination Post & Tail Length : .89 MM  [.035 INCH ]

Usage Conditions


  • Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]
Buy Now
Connectors, Interconnects- Memory Connectors- Inline Module Sockets - - Win Source Electronics
Win Source Electronics
Laguna Hills, CA, United States
Connectors, Interconnects- Memory Connectors- Inline Module Sockets
Connectors, Interconnects- Memory Connectors- Inline Module Sockets
Manufacturer: TE Connectivity AMP Connectors Category: Connectors, Interconnects- Memory Connectors- Inline Module Sockets Package: Tray Product Status: Active Connector Style: DIMM Number of Positions: 288 Memory Type: DDR5 SDRAM Mounting Type: Surface Mount Features: Board Lock, Latches Mounting Feature: Normal, Standard - Top

Manufacturer: TE Connectivity AMP Connectors
Category: Connectors, Interconnects- Memory Connectors- Inline Module Sockets
Package: Tray
Product Status: Active
Connector Style: DIMM
Number of Positions: 288
Memory Type: DDR5 SDRAM
Mounting Type: Surface Mount
Features: Board Lock, Latches
Mounting Feature: Normal, Standard - Top

Buy Now Datasheet

Technical Specifications

  TE Connectivity Win Source Electronics
Product Category IC Interconnect Components IC Interconnect Components
Product Number 2-2355626-1
Product Name DIMM Sockets Connectors, Interconnects- Memory Connectors- Inline Module Sockets
Product Type IC Socket IC Headers
Socket Type DIMM
Mounting SMT; Board Mount Surface Mount
Voltage Rating 1.1 volts
Current Rating 1.5 amps
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