TE ConnectivityPCB Headers & Receptacles2-2322946-2
Description
Body Features Primary Product Color : Orange
Configuration Features Number of Positions : 2 Number of Rows : 1 PCB Mount Orientation : Horizontal
Contact Features Contact Current Rating (Max) (AMP) : 1 Contact Mating Area Plating Material : Tin (Sn) Contact Size : .63mm Contact Type : Pin
Housing Features Centerline (Pitch) : 6.35 MM [.25 INCH ]
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With PCB Mount Alignment : With PCB Mount Retention : With
Operation/Applicatio
n Solder Process : Reflow Solder
Packaging Features Packaging Method : Tray
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board, Wire-to-Board Header Type : Fully Shrouded Mixed & Hybrid Header : No PCB Connector Assembly Type : PCB Mount Header Sealable : No
Termination Features Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -40 - 125 DEGC [-40 - 257 DEGF ]
TE Connectivity
Done
Request a Quote
Email Supplier
Description
Body Features Primary Product Color : Orange
Configuration Features Number of Positions : 2 Number of Rows : 1 PCB Mount Orientation : Horizontal
Contact Features Contact Current Rating (Max) (AMP) : 1 Contact Mating Area Plating Material : Tin (Sn) Contact Size : .63mm Contact Type : Pin
Housing Features Centerline (Pitch) : 6.35 MM [.25 INCH ]
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With PCB Mount Alignment : With PCB Mount Retention : With
Operation/Applicatio
n Solder Process : Reflow Solder
Packaging Features Packaging Method : Tray
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board, Wire-to-Board Header Type : Fully Shrouded Mixed & Hybrid Header : No PCB Connector Assembly Type : PCB Mount Header Sealable : No
Termination Features Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -40 - 125 DEGC [-40 - 257 DEGF ]
Body Features Primary Product Color : Orange
Configuration Features Number of Positions : 2 Number of Rows : 1 PCB Mount Orientation : Horizontal
Contact Features Contact Current Rating (Max) (AMP) : 1 Contact Mating Area Plating Material : Tin (Sn) Contact Size : .63mm Contact Type : Pin
Housing Features Centerline (Pitch) : 6.35 MM [.25 INCH ]
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With PCB Mount Alignment : With PCB Mount Retention : With
Operation/Applicatio
n Solder Process : Reflow Solder
Packaging Features Packaging Method : Tray
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board, Wire-to-Board Header Type : Fully Shrouded Mixed & Hybrid Header : No PCB Connector Assembly Type : PCB Mount Header Sealable : No
Termination Features Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -40 - 125 DEGC [-40 - 257 DEGF ]
Body Features
Primary Product Color : Orange
Configuration Features
Number of Positions : 2
Number of Rows : 1
PCB Mount Orientation : Horizontal
Contact Features
Contact Current Rating (Max) (AMP) : 1
Contact Mating Area Plating Material : Tin (Sn)
Contact Size : .63mm
Contact Type : Pin
Housing Features
Centerline (Pitch) : 6.35 MM [.25 INCH ]
Mechanical Attachment
Connector Mounting Type : Board Mount
Mating Alignment : With
PCB Mount Alignment : With
PCB Mount Retention : With
Operation/Application
Solder Process : Reflow Solder
Packaging Features
Packaging Method : Tray
Product Type Features
Connector & Contact Terminates To : Printed Circuit Board
Connector System : Board-to-Board, Wire-to-Board
Header Type : Fully Shrouded
Mixed & Hybrid Header : No
PCB Connector Assembly Type : PCB Mount Header
Sealable : No
Termination Features
Termination Method to PCB : Through Hole - Solder
Usage Conditions
Operating Temperature Range : -40 - 125 DEGC [-40 - 257 DEGF ]
