TE Connectivity Board-to-Board Headers & Receptacles 2-2007614-5

Description
Configuration Features Board-to-Board Configuration : Parallel Number of Positions : 200 Number of Rows : 18 PCB Mount Orientation : Vertical Stackable : Yes Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1 Contact Layout : Matrix Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .76 MICM  [29.9212 MICIN ] Contact Shape & Form : Single Beam, Square, Dual Beam Contact Type : Tab Mating Tab Thickness : .2 MM  [.008 INCH ] Mating Tab Width : 1 MM  [.039 INCH ] PCB Contact Termination Area Plating Material : Tin-Lead Dimensions Connector Height : 25.95 MM  [1.019835 INCH ] PCB Thickness (Recommended) : 1.57 MM  [.8 INCH ] Row-to-Row Spacing : 2 MM  [.0786 INCH ] Stack Height : 30 MM , 40 MM , 36 MM  [1.575 INCH ] Electrical Characteristics Dielectric Withstanding Voltage (Max) (VDC) : 500 Insulation Resistance (MEGO) : 18 Operating Voltage (VAC) : 48 Housing Features Centerline (Pitch) : 1.3 MM  [.051 INCH ] Housing Color : Natural Housing Material : Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : Without Mating Retention : With PCB Mount Alignment : Without PCB Mount Retention : Without Operation/Applicatio n Assembly Process Feature : None Circuit Application : Power & Signal Packaging Features Packaging Method : Tray Packaging Quantity : 28 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board Header Type : Pin Header PCB Connector Assembly Type : PCB Mount Header Sealable : No Termination Features Termination Method to Printed Circuit Board : Surface Mount - Solder Ball Usage Conditions Operating Temperature Range : 0 - 100 DEGC  [32 - 212 DEGF ]
  • Board-to-Board Headers & Receptacles - 2-2007614-5 - TE Connectivity
    TE Connectivity
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Description
Configuration Features Board-to-Board Configuration : Parallel Number of Positions : 200 Number of Rows : 18 PCB Mount Orientation : Vertical Stackable : Yes Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1 Contact Layout : Matrix Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .76 MICM  [29.9212 MICIN ] Contact Shape & Form : Single Beam, Square, Dual Beam Contact Type : Tab Mating Tab Thickness : .2 MM  [.008 INCH ] Mating Tab Width : 1 MM  [.039 INCH ] PCB Contact Termination Area Plating Material : Tin-Lead Dimensions Connector Height : 25.95 MM  [1.019835 INCH ] PCB Thickness (Recommended) : 1.57 MM  [.8 INCH ] Row-to-Row Spacing : 2 MM  [.0786 INCH ] Stack Height : 30 MM , 40 MM , 36 MM  [1.575 INCH ] Electrical Characteristics Dielectric Withstanding Voltage (Max) (VDC) : 500 Insulation Resistance (MEGO) : 18 Operating Voltage (VAC) : 48 Housing Features Centerline (Pitch) : 1.3 MM  [.051 INCH ] Housing Color : Natural Housing Material : Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : Without Mating Retention : With PCB Mount Alignment : Without PCB Mount Retention : Without Operation/Applicatio n Assembly Process Feature : None Circuit Application : Power & Signal Packaging Features Packaging Method : Tray Packaging Quantity : 28 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board Header Type : Pin Header PCB Connector Assembly Type : PCB Mount Header Sealable : No Termination Features Termination Method to Printed Circuit Board : Surface Mount - Solder Ball Usage Conditions Operating Temperature Range : 0 - 100 DEGC  [32 - 212 DEGF ]
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Company
Product
Description
Supplier Links
Board-to-Board Headers & Receptacles - 2-2007614-5 - TE Connectivity
TE Connectivity
Berwyn, PA, United States
Board-to-Board Headers & Receptacles
2-2007614-5
Board-to-Board Headers & Receptacles 2-2007614-5
Configuration Features Board-to-Board Configuration : Parallel Number of Positions : 200 Number of Rows : 18 PCB Mount Orientation : Vertical Stackable : Yes Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1 Contact Layout : Matrix Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .76 MICM  [29.9212 MICIN ] Contact Shape & Form : Single Beam, Square, Dual Beam Contact Type : Tab Mating Tab Thickness : .2 MM  [.008 INCH ] Mating Tab Width : 1 MM  [.039 INCH ] PCB Contact Termination Area Plating Material : Tin-Lead Dimensions Connector Height : 25.95 MM  [1.019835 INCH ] PCB Thickness (Recommended) : 1.57 MM  [.8 INCH ] Row-to-Row Spacing : 2 MM  [.0786 INCH ] Stack Height : 30 MM , 40 MM , 36 MM  [1.575 INCH ] Electrical Characteristics Dielectric Withstanding Voltage (Max) (VDC) : 500 Insulation Resistance (MEGO) : 18 Operating Voltage (VAC) : 48 Housing Features Centerline (Pitch) : 1.3 MM  [.051 INCH ] Housing Color : Natural Housing Material : Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : Without Mating Retention : With PCB Mount Alignment : Without PCB Mount Retention : Without Operation/Applicatio n Assembly Process Feature : None Circuit Application : Power & Signal Packaging Features Packaging Method : Tray Packaging Quantity : 28 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board Header Type : Pin Header PCB Connector Assembly Type : PCB Mount Header Sealable : No Termination Features Termination Method to Printed Circuit Board : Surface Mount - Solder Ball Usage Conditions Operating Temperature Range : 0 - 100 DEGC  [32 - 212 DEGF ]

Configuration Features


  • Board-to-Board Configuration : Parallel
  • Number of Positions : 200
  • Number of Rows : 18
  • PCB Mount Orientation : Vertical
  • Stackable : Yes

Contact Features


  • Contact Base Material : Copper Alloy
  • Contact Current Rating (Max) (AMP) : 1
  • Contact Layout : Matrix
  • Contact Mating Area Plating Material : Gold
  • Contact Mating Area Plating Material Thickness : .76 MICM  [29.9212 MICIN ]
  • Contact Shape & Form : Single Beam, Square, Dual Beam
  • Contact Type : Tab
  • Mating Tab Thickness : .2 MM  [.008 INCH ]
  • Mating Tab Width : 1 MM  [.039 INCH ]
  • PCB Contact Termination Area Plating Material : Tin-Lead

Dimensions


  • Connector Height : 25.95 MM  [1.019835 INCH ]
  • PCB Thickness (Recommended) : 1.57 MM  [.8 INCH ]
  • Row-to-Row Spacing : 2 MM  [.0786 INCH ]
  • Stack Height : 30 MM , 40 MM , 36 MM  [1.575 INCH ]

Electrical Characteristics


  • Dielectric Withstanding Voltage (Max) (VDC) : 500
  • Insulation Resistance (MEGO) : 18
  • Operating Voltage (VAC) : 48

Housing Features


  • Centerline (Pitch) : 1.3 MM  [.051 INCH ]
  • Housing Color : Natural
  • Housing Material : Thermoplastic

Industry Standards


  • UL Flammability Rating : UL 94V-0

Mechanical Attachment


  • Connector Mounting Type : Board Mount
  • Mating Alignment : Without
  • Mating Retention : With
  • PCB Mount Alignment : Without
  • PCB Mount Retention : Without

Operation/Application


  • Assembly Process Feature : None
  • Circuit Application : Power & Signal

Packaging Features


  • Packaging Method : Tray
  • Packaging Quantity : 28

Product Type Features


  • Connector & Contact Terminates To : Printed Circuit Board
  • Connector System : Board-to-Board
  • Header Type : Pin Header
  • PCB Connector Assembly Type : PCB Mount Header
  • Sealable : No

Termination Features


  • Termination Method to Printed Circuit Board : Surface Mount - Solder Ball

Usage Conditions


  • Operating Temperature Range : 0 - 100 DEGC  [32 - 212 DEGF ]
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Acme Chip Technology Co., Limited
Shenzhen, China
Connectors, Interconnects - Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)
2-2007614-5
Connectors, Interconnects - Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) 2-2007614-5
CONN DIFF ARRAY PLUG 200POS SMD

CONN DIFF ARRAY PLUG 200POS SMD

Supplier's Site

Technical Specifications

  TE Connectivity Acme Chip Technology Co., Limited
Product Category Electrical Connectors Electrical Connectors
Product Number 2-2007614-5 2-2007614-5
Product Name Board-to-Board Headers & Receptacles Connectors, Interconnects - Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)
Connector Type Board to Board Connector Rectangular Connectors, Heavy Duty
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