TE Connectivity DIP Sockets 2-1437514-8

Body Features Connector Profile : Zero Frame Style : Open, Film Carrier Configuration Features Number of Positions : 20 PCB Mount Orientation : Vertical Contact Features Contact Base Material : Beryllium Copper Contact Current Rating (Max) (AMP) : 3 Contact Fabrication : Solid Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 25 Contact Type : Socket IC Socket Type : DIP Mating Contact Type : Four-Fingered Dimensions Profile Height from PCB : 0 MM  [0 INCH ] Row-to-Row Spacing : 7.62 MM  [.3 INCH ] Electrical Characteristics Contact Resistance (MOHM) : 10 Insulation Resistance (MEGO) : 1000 Housing Features Centerline (Pitch) : 2.54 MM  [.1 INCH ] Mechanical Attachment Connector Mounting Type : Board Mount Operation/Applicatio n Circuit Application : Signal Packaging Features Packaging Method : Reel Packaging Quantity : 5000 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Leg Style : Through Hole Termination Features Termination Method to Printed Circuit Board : Through Hole - Press-Fit Termination Post & Tail Length : 3.18 MM  [.125 INCH ] Usage Conditions Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]