Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 13 Contact Mating Area Plating Material : Silver (Ag) Contact Mating Area Plating Material Finish : Semi-Bright Contact Mating Area Plating Material Thickness : 5.08 MICM [200 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : With Contact Shape & Form : Round Contact Size : Size 16 Contact Type : Pin Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1.27 MICM [50 MICIN ] Mating Pin Diameter : 1.57 MM [.062 INCH ]
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Loose Piece Packaging Quantity : 1250
Product Type Features Sealable : No
Termination Features Product Terminates To : Wire & Cable Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -55 - 150 DEGC [-67 - 302 DEGF ]
TE Connectivity
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Description
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 13 Contact Mating Area Plating Material : Silver (Ag) Contact Mating Area Plating Material Finish : Semi-Bright Contact Mating Area Plating Material Thickness : 5.08 MICM [200 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : With Contact Shape & Form : Round Contact Size : Size 16 Contact Type : Pin Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1.27 MICM [50 MICIN ] Mating Pin Diameter : 1.57 MM [.062 INCH ]
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Loose Piece Packaging Quantity : 1250
Product Type Features Sealable : No
Termination Features Product Terminates To : Wire & Cable Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -55 - 150 DEGC [-67 - 302 DEGF ]
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 13 Contact Mating Area Plating Material : Silver (Ag) Contact Mating Area Plating Material Finish : Semi-Bright Contact Mating Area Plating Material Thickness : 5.08 MICM [200 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : With Contact Shape & Form : Round Contact Size : Size 16 Contact Type : Pin Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1.27 MICM [50 MICIN ] Mating Pin Diameter : 1.57 MM [.062 INCH ]
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Loose Piece Packaging Quantity : 1250
Product Type Features Sealable : No
Termination Features Product Terminates To : Wire & Cable Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -55 - 150 DEGC [-67 - 302 DEGF ]
Contact Features
Contact Base Material : Copper Alloy
Contact Current Rating (Max) (AMP) : 13
Contact Mating Area Plating Material : Silver (Ag)
Contact Mating Area Plating Material Finish : Semi-Bright
Contact Mating Area Plating Material Thickness : 5.08 MICM [200 MICIN ]
Contact Orientation : Straight
Contact Retention Within Housing : With
Contact Shape & Form : Round
Contact Size : Size 16
Contact Type : Pin
Contact Underplating Material : Nickel
Contact Underplating Material Thickness : 1.27 MICM [50 MICIN ]
Mating Pin Diameter : 1.57 MM [.062 INCH ]
Operation/Application
Circuit Application : Power
Packaging Features
Packaging Method : Loose Piece
Packaging Quantity : 1250
Product Type Features
Sealable : No
Termination Features
Product Terminates To : Wire & Cable
Termination Method to PCB : Through Hole - Solder
Usage Conditions
Operating Temperature Range : -55 - 150 DEGC [-67 - 302 DEGF ]
