Configuration Features Number of Dual Positions : 15 Number of Positions : 30 Number of Power Positions : 30 Number of Signal Positions : 0
Contact Features Contact Current Rating (Max) (AMP) : 3 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .76 MICM [29.92 MICIN ]
Dimensions Power Contact Centerline : 1.5 MM [1.5 INCH ]
Electrical Characteristics Operating Voltage (VAC) : 250 Operating Voltage (V) : 250
Housing Features Centerline (Pitch) : 1.5 MM [.059 INCH ]
Mechanical Attachment Connector Mounting Type : Board Mount
Operation/Applicatio
n Circuit Application : Power & Signal
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board
Termination Features Termination Method to PCB : Through Hole - Press-Fit, Through Hole - Solder
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Configuration Features
- Number of Dual Positions : 15
- Number of Positions : 30
- Number of Power Positions : 30
- Number of Signal Positions : 0
Contact Features
- Contact Current Rating (Max) (AMP) : 3
- Contact Mating Area Plating Material : Gold (Au)
- Contact Mating Area Plating Material Thickness : .76 MICM [29.92 MICIN ]
Dimensions
- Power Contact Centerline : 1.5 MM [1.5 INCH ]
Electrical Characteristics
- Operating Voltage (VAC) : 250
- Operating Voltage (V) : 250
Housing Features
- Centerline (Pitch) : 1.5 MM [.059 INCH ]
Mechanical Attachment
- Connector Mounting Type : Board Mount
Operation/Application
- Circuit Application : Power & Signal
Product Type Features
- Connector & Contact Terminates To : Printed Circuit Board
- Connector System : Board-to-Board
Termination Features
- Termination Method to PCB : Through Hole - Press-Fit, Through Hole - Solder
Usage Conditions
- Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
