TE ConnectivityHard Metric Backplane Connectors188748-1
Description
Configuration Features Backplane Architecture : Mezzanine Number of Columns : 11 Number of Positions : 55 Number of Rows : 5 PCB Mount Orientation : Right Angle Rows Loaded : A,B,C,D,E
Contact Features CompactPCI Designation : None Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 1.5 Contact Mating Area Length (MM) : 5.2 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .8 MICM [31.5 MICIN ] Contact Type : Pin Contact Underplating Material : Nickel Feedthrough Post Length (MM) : 3.7 PCB Contact Termination Area Plating Material : Tin-Lead
Dimensions Backplane Module Length (MM) : 25
Housing Features Centerline (Pitch) : 2 MM [.078 INCH ] Housing Color : Gray Housing Material : Polyester - GF
Industry Standards AdvancedTCA Specified Product : No UL Flammability Rating : UL 94V-0
Mechanical Attachment Connector Mounting Type : Board Mount Front Mating Level : Level 1
Operation/Applicatio
n Circuit Application : Power & Signal Shielded : No
Packaging Features Packaging Method : Tray Packaging Quantity : 22
Product Type Features Backplane Interface Type : 2mm HM Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Assembly Type : PCB Mount Header Sealable : No
Signal Characteristics Crosstalk Version : Standard Data Rate (GBS) : ≤1
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
TE Connectivity
Lingto Electronic Limited
Newark, An Avnet Company
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Datasheet
Description
Configuration Features Backplane Architecture : Mezzanine Number of Columns : 11 Number of Positions : 55 Number of Rows : 5 PCB Mount Orientation : Right Angle Rows Loaded : A,B,C,D,E
Contact Features CompactPCI Designation : None Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 1.5 Contact Mating Area Length (MM) : 5.2 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .8 MICM [31.5 MICIN ] Contact Type : Pin Contact Underplating Material : Nickel Feedthrough Post Length (MM) : 3.7 PCB Contact Termination Area Plating Material : Tin-Lead
Dimensions Backplane Module Length (MM) : 25
Housing Features Centerline (Pitch) : 2 MM [.078 INCH ] Housing Color : Gray Housing Material : Polyester - GF
Industry Standards AdvancedTCA Specified Product : No UL Flammability Rating : UL 94V-0
Mechanical Attachment Connector Mounting Type : Board Mount Front Mating Level : Level 1
Operation/Applicatio
n Circuit Application : Power & Signal Shielded : No
Packaging Features Packaging Method : Tray Packaging Quantity : 22
Product Type Features Backplane Interface Type : 2mm HM Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Assembly Type : PCB Mount Header Sealable : No
Signal Characteristics Crosstalk Version : Standard Data Rate (GBS) : ≤1
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
Configuration Features Backplane Architecture : Mezzanine Number of Columns : 11 Number of Positions : 55 Number of Rows : 5 PCB Mount Orientation : Right Angle Rows Loaded : A,B,C,D,E
Contact Features CompactPCI Designation : None Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 1.5 Contact Mating Area Length (MM) : 5.2 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .8 MICM [31.5 MICIN ] Contact Type : Pin Contact Underplating Material : Nickel Feedthrough Post Length (MM) : 3.7 PCB Contact Termination Area Plating Material : Tin-Lead
Dimensions Backplane Module Length (MM) : 25
Housing Features Centerline (Pitch) : 2 MM [.078 INCH ] Housing Color : Gray Housing Material : Polyester - GF
Industry Standards AdvancedTCA Specified Product : No UL Flammability Rating : UL 94V-0
Mechanical Attachment Connector Mounting Type : Board Mount Front Mating Level : Level 1
Operation/Applicatio
n Circuit Application : Power & Signal Shielded : No
Packaging Features Packaging Method : Tray Packaging Quantity : 22
Product Type Features Backplane Interface Type : 2mm HM Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Assembly Type : PCB Mount Header Sealable : No
Signal Characteristics Crosstalk Version : Standard Data Rate (GBS) : ≤1
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
Configuration Features
Backplane Architecture : Mezzanine
Number of Columns : 11
Number of Positions : 55
Number of Rows : 5
PCB Mount Orientation : Right Angle
Rows Loaded : A,B,C,D,E
Contact Features
CompactPCI Designation : None
Contact Base Material : Phosphor Bronze
Contact Current Rating (Max) (AMP) : 1.5
Contact Mating Area Length (MM) : 5.2
Contact Mating Area Plating Material : Gold
Contact Mating Area Plating Material Thickness : .8 MICM [31.5 MICIN ]
Contact Type : Pin
Contact Underplating Material : Nickel
Feedthrough Post Length (MM) : 3.7
PCB Contact Termination Area Plating Material : Tin-Lead
Dimensions
Backplane Module Length (MM) : 25
Housing Features
Centerline (Pitch) : 2 MM [.078 INCH ]
Housing Color : Gray
Housing Material : Polyester - GF
Industry Standards
AdvancedTCA Specified Product : No
UL Flammability Rating : UL 94V-0
Mechanical Attachment
Connector Mounting Type : Board Mount
Front Mating Level : Level 1
Operation/Application
Circuit Application : Power & Signal
Shielded : No
Packaging Features
Packaging Method : Tray
Packaging Quantity : 22
Product Type Features
Backplane Interface Type : 2mm HM
Connector & Contact Terminates To : Printed Circuit Board
Connector System : Board-to-Board
PCB Connector Assembly Type : PCB Mount Header
Sealable : No
Signal Characteristics
Crosstalk Version : Standard
Data Rate (GBS) : ≤1
Usage Conditions
Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]