Body Features Connector Profile : Standard Ejector Location : Both Ends Ejector Type : Locking Latch Material : Stainless Steel Module Key Type : SGRAM PCB Retention Feature Material : Copper Alloy
Configuration Features Module Orientation : Right Angle Number of Bays : 2 Number of Keys : 1 Number of Positions : 200 Number of Rows : 2
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold Flash Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Gold Flash Socket Style : SO DIMM
Dimensions Profile Height from PCB : 9 MM [.35 INCH ] Row-to-Row Spacing : 6.2 MM [.244 INCH ]
Electrical Characteristics DRAM Voltage (V) : 1.8
Housing Features Centerline (Pitch) : .6 MM [.024 INCH ] Housing Color : Black Housing Material : High Temperature Thermoplastic
Industry Standards UL Flammability Rating : UL 94V-0
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : Without Mating Alignment Type : None Mount Angle : Right Angle PCB Mount Alignment Type : Locating Posts PCB Mount Retention : With PCB Mount Retention Type : Solder Tail
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Semi-Hard Tray Packaging Quantity : 20
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board DRAM Type : Double Data Rate (DDR)
Termination Features Insertion Style : Cam-In Termination Method to Printed Circuit Board : Surface Mount
Usage Conditions Operating Temperature Range : -55 - 85 DEGC [-67 - 185 DEGF ]
Body Features
- Connector Profile : Standard
- Ejector Location : Both Ends
- Ejector Type : Locking
- Latch Material : Stainless Steel
- Module Key Type : SGRAM
- PCB Retention Feature Material : Copper Alloy
Configuration Features
- Module Orientation : Right Angle
- Number of Bays : 2
- Number of Keys : 1
- Number of Positions : 200
- Number of Rows : 2
Contact Features
- Contact Base Material : Copper Alloy
- Contact Current Rating (Max) (AMP) : .5
- Contact Mating Area Plating Material : Gold Flash
- Memory Socket Type : Memory Card
- PCB Contact Termination Area Plating Material : Gold Flash
- Socket Style : SO DIMM
Dimensions
- Profile Height from PCB : 9 MM [.35 INCH ]
- Row-to-Row Spacing : 6.2 MM [.244 INCH ]
Electrical Characteristics
Housing Features
- Centerline (Pitch) : .6 MM [.024 INCH ]
- Housing Color : Black
- Housing Material : High Temperature Thermoplastic
Industry Standards
- UL Flammability Rating : UL 94V-0
Mechanical Attachment
- Connector Mounting Type : Board Mount
- Mating Alignment : Without
- Mating Alignment Type : None
- Mount Angle : Right Angle
- PCB Mount Alignment Type : Locating Posts
- PCB Mount Retention : With
- PCB Mount Retention Type : Solder Tail
Operation/Application
- Circuit Application : Signal
Packaging Features
- Packaging Method : Semi-Hard Tray
- Packaging Quantity : 20
Product Type Features
- Connector & Contact Terminates To : Printed Circuit Board
- Connector System : Board-to-Board
- DRAM Type : Double Data Rate (DDR)
Termination Features
- Insertion Style : Cam-In
- Termination Method to Printed Circuit Board : Surface Mount
Usage Conditions
- Operating Temperature Range : -55 - 85 DEGC [-67 - 185 DEGF ]
