TE Connectivity Data Connectivity Headers 1823071-2

Description
Body Features Body Material : PBT GF Connector & Keying Code : B PCB Retention Feature Plating Material : Tin Configuration Features Number of Positions : 4 PCB Mount Orientation : Vertical Contact Features Center Contact : With Contact Mating Area Plating Material : Gold Contact Type : Pin Mating Pin Diameter : .6 MM  [.024 INCH ] RF Connector Center Contact Plating Material : Gold (Au) Dimensions Connector Height : 14.2 MM  [.559 INCH ] Product Length : 27.4 MM  [1.079 INCH ] Product Width : 12 MM  [.472 INCH ] Electrical Characteristics Impedance (OHM) : 100 Housing Features Centerline (Pitch) : 2 MM  [.079 INCH ] Housing Color : Natural Mechanical Attachment Mating Retention : With PCB Mount Retention : With PCB Mount Retention Type : Boardlock Panel Attachment Style : Rear Mount Operation/Applicatio n Circuit Application : Signal Shielded : Yes Other Dielectric Material : LCP Outer Contact Plating Material : Other Solder Process : Reflow Packaging Features Packaging Method : Tube Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Wire-to-Device Hybrid Connector : No Sealable : No Signal Characteristics Operating Frequency Range (MHZ) : 0 - 3000 Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder Usage Conditions Operating Temperature (Max) : 85 DEGC , 70 DEGC , 80 DEGC , 75 DEGC , 65 DEGC , 90 DEGC , 105 DEGC , 100 DEGC  [176 DEGF , 194 DEGF , 185 DEGF , 212 DEGF , 167 DEGF , 158 DEGF , 149 DEGF , 221 DEGF ] Operating Temperature Range : -40 - 105 DEGC  [-40 - 221 DEGF ]
Request a Quote
Description
Body Features Body Material : PBT GF Connector & Keying Code : B PCB Retention Feature Plating Material : Tin Configuration Features Number of Positions : 4 PCB Mount Orientation : Vertical Contact Features Center Contact : With Contact Mating Area Plating Material : Gold Contact Type : Pin Mating Pin Diameter : .6 MM  [.024 INCH ] RF Connector Center Contact Plating Material : Gold (Au) Dimensions Connector Height : 14.2 MM  [.559 INCH ] Product Length : 27.4 MM  [1.079 INCH ] Product Width : 12 MM  [.472 INCH ] Electrical Characteristics Impedance (OHM) : 100 Housing Features Centerline (Pitch) : 2 MM  [.079 INCH ] Housing Color : Natural Mechanical Attachment Mating Retention : With PCB Mount Retention : With PCB Mount Retention Type : Boardlock Panel Attachment Style : Rear Mount Operation/Applicatio n Circuit Application : Signal Shielded : Yes Other Dielectric Material : LCP Outer Contact Plating Material : Other Solder Process : Reflow Packaging Features Packaging Method : Tube Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Wire-to-Device Hybrid Connector : No Sealable : No Signal Characteristics Operating Frequency Range (MHZ) : 0 - 3000 Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder Usage Conditions Operating Temperature (Max) : 85 DEGC , 70 DEGC , 80 DEGC , 75 DEGC , 65 DEGC , 90 DEGC , 105 DEGC , 100 DEGC  [176 DEGF , 194 DEGF , 185 DEGF , 212 DEGF , 167 DEGF , 158 DEGF , 149 DEGF , 221 DEGF ] Operating Temperature Range : -40 - 105 DEGC  [-40 - 221 DEGF ]
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Data Connectivity Headers - 1823071-2 - TE Connectivity
Berwyn, PA, United States
Data Connectivity Headers
1823071-2
Data Connectivity Headers 1823071-2
Body Features Body Material : PBT GF Connector & Keying Code : B PCB Retention Feature Plating Material : Tin Configuration Features Number of Positions : 4 PCB Mount Orientation : Vertical Contact Features Center Contact : With Contact Mating Area Plating Material : Gold Contact Type : Pin Mating Pin Diameter : .6 MM  [.024 INCH ] RF Connector Center Contact Plating Material : Gold (Au) Dimensions Connector Height : 14.2 MM  [.559 INCH ] Product Length : 27.4 MM  [1.079 INCH ] Product Width : 12 MM  [.472 INCH ] Electrical Characteristics Impedance (OHM) : 100 Housing Features Centerline (Pitch) : 2 MM  [.079 INCH ] Housing Color : Natural Mechanical Attachment Mating Retention : With PCB Mount Retention : With PCB Mount Retention Type : Boardlock Panel Attachment Style : Rear Mount Operation/Applicatio n Circuit Application : Signal Shielded : Yes Other Dielectric Material : LCP Outer Contact Plating Material : Other Solder Process : Reflow Packaging Features Packaging Method : Tube Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Wire-to-Device Hybrid Connector : No Sealable : No Signal Characteristics Operating Frequency Range (MHZ) : 0 - 3000 Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder Usage Conditions Operating Temperature (Max) : 85 DEGC , 70 DEGC , 80 DEGC , 75 DEGC , 65 DEGC , 90 DEGC , 105 DEGC , 100 DEGC  [176 DEGF , 194 DEGF , 185 DEGF , 212 DEGF , 167 DEGF , 158 DEGF , 149 DEGF , 221 DEGF ] Operating Temperature Range : -40 - 105 DEGC  [-40 - 221 DEGF ]

Body Features


  • Body Material : PBT GF
  • Connector & Keying Code : B
  • PCB Retention Feature Plating Material : Tin

Configuration Features


  • Number of Positions : 4
  • PCB Mount Orientation : Vertical

Contact Features


  • Center Contact : With
  • Contact Mating Area Plating Material : Gold
  • Contact Type : Pin
  • Mating Pin Diameter : .6 MM  [.024 INCH ]
  • RF Connector Center Contact Plating Material : Gold (Au)

Dimensions


  • Connector Height : 14.2 MM  [.559 INCH ]
  • Product Length : 27.4 MM  [1.079 INCH ]
  • Product Width : 12 MM  [.472 INCH ]

Electrical Characteristics


  • Impedance (OHM) : 100

Housing Features


  • Centerline (Pitch) : 2 MM  [.079 INCH ]
  • Housing Color : Natural

Mechanical Attachment


  • Mating Retention : With
  • PCB Mount Retention : With
  • PCB Mount Retention Type : Boardlock
  • Panel Attachment Style : Rear Mount

Operation/Application


  • Circuit Application : Signal
  • Shielded : Yes

Other


  • Dielectric Material : LCP
  • Outer Contact Plating Material : Other
  • Solder Process : Reflow

Packaging Features


  • Packaging Method : Tube

Product Type Features


  • Connector & Contact Terminates To : Printed Circuit Board
  • Connector System : Wire-to-Device
  • Hybrid Connector : No
  • Sealable : No

Signal Characteristics


  • Operating Frequency Range (MHZ) : 0 - 3000

Termination Features


  • Termination Method to Printed Circuit Board : Through Hole - Solder

Usage Conditions


  • Operating Temperature (Max) : 85 DEGC , 70 DEGC , 80 DEGC , 75 DEGC , 65 DEGC , 90 DEGC , 105 DEGC , 100 DEGC  [176 DEGF , 194 DEGF , 185 DEGF , 212 DEGF , 167 DEGF , 158 DEGF , 149 DEGF , 221 DEGF ]
  • Operating Temperature Range : -40 - 105 DEGC  [-40 - 221 DEGF ]
Buy Now
Hsd,hdr Assy,90Deg,cod B Amp - Te Connectivity - 75AC6020 - Newark, An Avnet Company
Chicago, IL, United States
Hsd,hdr Assy,90Deg,cod B Amp - Te Connectivity
75AC6020
Hsd,hdr Assy,90Deg,cod B Amp - Te Connectivity 75AC6020
HSD,HDR ASSY,90DEG,COD B

HSD,HDR ASSY,90DEG,COD B

Supplier's Site

Technical Specifications

  TE Connectivity Newark, An Avnet Company
Product Category Electrical Connectors Electrical Connectors
Product Number 1823071-2 75AC6020
Product Name Data Connectivity Headers Hsd,hdr Assy,90Deg,cod B Amp - Te Connectivity
Termination Through Hole - Solder
Unlock Full Specs
to access all available technical data

Similar Products