Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 5 Contact Mating Area Plating Material : Tin (Sn) Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ] Contact Orientation : Straight Contact Type : Socket PCB Contact Termination Area Plating Material : Tin PCB Contact Termination Area Plating Material Thickness : .762 MICM [30 MICIN ]
Dimensions Compatible Insulation Diameter Range : 1.8 - 2.3 MM [.071 - .091 INCH ] Wire Size (MMSQ) : .3 - .9 Wire Size (AWG) : 22 - 18
Mechanical Attachment PCB Mount Retention : Without Wire Insulation Support : With
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Loose Piece Packaging Quantity : 2000
Product Type Features Applied Pressure : High
Termination Features Product Terminates To : Wire & Cable
Usage Conditions Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
TE Connectivity
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Description
Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 5 Contact Mating Area Plating Material : Tin (Sn) Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ] Contact Orientation : Straight Contact Type : Socket PCB Contact Termination Area Plating Material : Tin PCB Contact Termination Area Plating Material Thickness : .762 MICM [30 MICIN ]
Dimensions Compatible Insulation Diameter Range : 1.8 - 2.3 MM [.071 - .091 INCH ] Wire Size (MMSQ) : .3 - .9 Wire Size (AWG) : 22 - 18
Mechanical Attachment PCB Mount Retention : Without Wire Insulation Support : With
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Loose Piece Packaging Quantity : 2000
Product Type Features Applied Pressure : High
Termination Features Product Terminates To : Wire & Cable
Usage Conditions Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 5 Contact Mating Area Plating Material : Tin (Sn) Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ] Contact Orientation : Straight Contact Type : Socket PCB Contact Termination Area Plating Material : Tin PCB Contact Termination Area Plating Material Thickness : .762 MICM [30 MICIN ]
Dimensions Compatible Insulation Diameter Range : 1.8 - 2.3 MM [.071 - .091 INCH ] Wire Size (MMSQ) : .3 - .9 Wire Size (AWG) : 22 - 18
Mechanical Attachment PCB Mount Retention : Without Wire Insulation Support : With
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Loose Piece Packaging Quantity : 2000
Product Type Features Applied Pressure : High
Termination Features Product Terminates To : Wire & Cable
Usage Conditions Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
Contact Features
Contact Base Material : Phosphor Bronze
Contact Current Rating (Max) (AMP) : 5
Contact Mating Area Plating Material : Tin (Sn)
Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ]
Contact Orientation : Straight
Contact Type : Socket
PCB Contact Termination Area Plating Material : Tin
PCB Contact Termination Area Plating Material Thickness : .762 MICM [30 MICIN ]
Dimensions
Compatible Insulation Diameter Range : 1.8 - 2.3 MM [.071 - .091 INCH ]
Wire Size (MMSQ) : .3 - .9
Wire Size (AWG) : 22 - 18
Mechanical Attachment
PCB Mount Retention : Without
Wire Insulation Support : With
Operation/Application
Circuit Application : Signal
Packaging Features
Packaging Method : Loose Piece
Packaging Quantity : 2000
Product Type Features
Applied Pressure : High
Termination Features
Product Terminates To : Wire & Cable
Usage Conditions
Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
