Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 3 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .4 MICM [15.748 MICIN ] Contact Orientation : Straight Contact Type : Socket PCB Contact Termination Area Plating Material : Gold Flash
Dimensions Compatible Insulation Diameter Range : .64 - 1.27 MM [.025 - .05 INCH ] Wire Size (MMSQ) : .05 - .09 Wire Size (AWG) : 30 - 28
Mechanical Attachment Contact Retention Type Within Housing : Snap-In PCB Mount Retention : Without Wire Insulation Support : With
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Loose Piece Packaging Quantity : 2000
Product Type Features Applied Pressure : Standard
Termination Features Product Terminates To : Wire & Cable
Usage Conditions Operating Temperature Range : -40 - 80 DEGC [-40 - 176 DEGF ]
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Description
Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 3 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .4 MICM [15.748 MICIN ] Contact Orientation : Straight Contact Type : Socket PCB Contact Termination Area Plating Material : Gold Flash
Dimensions Compatible Insulation Diameter Range : .64 - 1.27 MM [.025 - .05 INCH ] Wire Size (MMSQ) : .05 - .09 Wire Size (AWG) : 30 - 28
Mechanical Attachment Contact Retention Type Within Housing : Snap-In PCB Mount Retention : Without Wire Insulation Support : With
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Loose Piece Packaging Quantity : 2000
Product Type Features Applied Pressure : Standard
Termination Features Product Terminates To : Wire & Cable
Usage Conditions Operating Temperature Range : -40 - 80 DEGC [-40 - 176 DEGF ]
Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 3 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .4 MICM [15.748 MICIN ] Contact Orientation : Straight Contact Type : Socket PCB Contact Termination Area Plating Material : Gold Flash
Dimensions Compatible Insulation Diameter Range : .64 - 1.27 MM [.025 - .05 INCH ] Wire Size (MMSQ) : .05 - .09 Wire Size (AWG) : 30 - 28
Mechanical Attachment Contact Retention Type Within Housing : Snap-In PCB Mount Retention : Without Wire Insulation Support : With
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Loose Piece Packaging Quantity : 2000
Product Type Features Applied Pressure : Standard
Termination Features Product Terminates To : Wire & Cable
Usage Conditions Operating Temperature Range : -40 - 80 DEGC [-40 - 176 DEGF ]
Contact Features
Contact Base Material : Phosphor Bronze
Contact Current Rating (Max) (AMP) : 3
Contact Mating Area Plating Material : Gold (Au)
Contact Mating Area Plating Material Thickness : .4 MICM [15.748 MICIN ]
Contact Orientation : Straight
Contact Type : Socket
PCB Contact Termination Area Plating Material : Gold Flash
Dimensions
Compatible Insulation Diameter Range : .64 - 1.27 MM [.025 - .05 INCH ]
Wire Size (MMSQ) : .05 - .09
Wire Size (AWG) : 30 - 28
Mechanical Attachment
Contact Retention Type Within Housing : Snap-In
PCB Mount Retention : Without
Wire Insulation Support : With
Operation/Application
Circuit Application : Signal
Packaging Features
Packaging Method : Loose Piece
Packaging Quantity : 2000
Product Type Features
Applied Pressure : Standard
Termination Features
Product Terminates To : Wire & Cable
Usage Conditions
Operating Temperature Range : -40 - 80 DEGC [-40 - 176 DEGF ]
