Body Features Primary Product Color : Gray
Configuration Features Number of Positions : 40 Number of Rows : 2 Number of Sections : 1 Number of Signal Positions : 40 PCB Mount Orientation : Vertical
Contact Features Contact Mating Area Plating Material : Tin Contact Size : .63mm Mating Tab Thickness : .64 MM [.025 INCH ] Mating Tab Width : .64 MM [.025 INCH ]
Dimensions Connector Length : 60 MM [2.362 INCH ] Connector Width : 12.7 MM [.5 INCH ] PCB Thickness (Recommended) : 1.6 MM [.063 INCH ] Profile Height from PCB : 20.2 MM [.795 INCH ]
Electrical Characteristics Nominal Voltage Architecture (V) : 12 Operating Voltage (VDC) : 13.5
Housing Features Centerline (Pitch) : 2.2 MM [.087 INCH ]
Mechanical Attachment Mating Retention : With Mating Retention Type : Locking Interface Mounting Holes : Without PCB Mount Alignment : With PCB Mount Retention : With PCB Mount Retention Type : Boardlock Panel Mount Feature : Without
Operation/Applicatio
n Circuit Application : Signal Shielded : No Solder Process : Reflow Solder
Packaging Features Packaging Method : Tray Packaging Quantity : 390
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Mixed & Hybrid Header : No Sealable : No
Termination Features Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature (Max) : 80 DEGC , 90 DEGC , 65 DEGC , 85 DEGC , 75 DEGC , 100 DEGC , 70 DEGC [212 DEGF , 149 DEGF , 176 DEGF , 194 DEGF , 167 DEGF , 158 DEGF , 185 DEGF ] Operating Temperature Range : -40 - 100 DEGC [-40 - 212 DEGF ]
Body Features
- Primary Product Color : Gray
Configuration Features
- Number of Positions : 40
- Number of Rows : 2
- Number of Sections : 1
- Number of Signal Positions : 40
- PCB Mount Orientation : Vertical
Contact Features
- Contact Mating Area Plating Material : Tin
- Contact Size : .63mm
- Mating Tab Thickness : .64 MM [.025 INCH ]
- Mating Tab Width : .64 MM [.025 INCH ]
Dimensions
- Connector Length : 60 MM [2.362 INCH ]
- Connector Width : 12.7 MM [.5 INCH ]
- PCB Thickness (Recommended) : 1.6 MM [.063 INCH ]
- Profile Height from PCB : 20.2 MM [.795 INCH ]
Electrical Characteristics
- Nominal Voltage Architecture (V) : 12
- Operating Voltage (VDC) : 13.5
Housing Features
- Centerline (Pitch) : 2.2 MM [.087 INCH ]
Mechanical Attachment
- Mating Retention : With
- Mating Retention Type : Locking Interface
- Mounting Holes : Without
- PCB Mount Alignment : With
- PCB Mount Retention : With
- PCB Mount Retention Type : Boardlock
- Panel Mount Feature : Without
Operation/Application
- Circuit Application : Signal
- Shielded : No
- Solder Process : Reflow Solder
Packaging Features
- Packaging Method : Tray
- Packaging Quantity : 390
Product Type Features
- Connector & Contact Terminates To : Printed Circuit Board
- Mixed & Hybrid Header : No
- Sealable : No
Termination Features
- Termination Method to PCB : Through Hole - Solder
Usage Conditions
- Operating Temperature (Max) : 80 DEGC , 90 DEGC , 65 DEGC , 85 DEGC , 75 DEGC , 100 DEGC , 70 DEGC [212 DEGF , 149 DEGF , 176 DEGF , 194 DEGF , 167 DEGF , 158 DEGF , 185 DEGF ]
- Operating Temperature Range : -40 - 100 DEGC [-40 - 212 DEGF ]
