Contact Features Contact Base Material : Tellurium Copper Contact Current Rating (Max) (AMP) : 200 Contact Mating Area Plating Material : Silver Contact Mating Area Plating Material Thickness : 5.08 MICM [200 MICIN ] Contact Orientation : Straight Contact Type : Pin Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1 MICM [40 MICIN ] Mating Pin Diameter : 9.06 MM [.357 INCH ] Wire Contact Termination Area Plating Material : Silver Wire Contact Termination Area Plating Thickness : 5.08 MICM [200 MICIN ]
Electrical Characteristics Operating Voltage (VAC) : 250 Operating Voltage (VDC) : 250
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Bag
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Crimp
Usage Conditions Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
Contact Features
- Contact Base Material : Tellurium Copper
- Contact Current Rating (Max) (AMP) : 200
- Contact Mating Area Plating Material : Silver
- Contact Mating Area Plating Material Thickness : 5.08 MICM [200 MICIN ]
- Contact Orientation : Straight
- Contact Type : Pin
- Contact Underplating Material : Nickel
- Contact Underplating Material Thickness : 1 MICM [40 MICIN ]
- Mating Pin Diameter : 9.06 MM [.357 INCH ]
- Wire Contact Termination Area Plating Material : Silver
- Wire Contact Termination Area Plating Thickness : 5.08 MICM [200 MICIN ]
Electrical Characteristics
- Operating Voltage (VAC) : 250
- Operating Voltage (VDC) : 250
Operation/Application
- Circuit Application : Power
Packaging Features
Termination Features
- Product Terminates To : Wire & Cable
- Termination Method to Wire & Cable : Crimp
Usage Conditions
- Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
