Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 125 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : Without Contact Size : 4 Contact Type : Pin Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1.27 MICM [50 MICIN ] Mating Pin Diameter : 6.35 MM [.25 INCH ] Wire Contact Termination Area Plating Material : Gold Wire Contact Termination Area Plating Thickness : .76 MICM [30 MICIN ]
Industry Standards Glow Wire Rating : Standard Part - Not Glow Wire
Mechanical Attachment Connector Mounting Type : Board Mount Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Package Packaging Quantity : 200
Product Type Features Connector & Contact Terminates To : Bus Bar Connector System : Wire-to-Board Power Contact Type : Contact
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
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Description
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 125 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : Without Contact Size : 4 Contact Type : Pin Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1.27 MICM [50 MICIN ] Mating Pin Diameter : 6.35 MM [.25 INCH ] Wire Contact Termination Area Plating Material : Gold Wire Contact Termination Area Plating Thickness : .76 MICM [30 MICIN ]
Industry Standards Glow Wire Rating : Standard Part - Not Glow Wire
Mechanical Attachment Connector Mounting Type : Board Mount Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Package Packaging Quantity : 200
Product Type Features Connector & Contact Terminates To : Bus Bar Connector System : Wire-to-Board Power Contact Type : Contact
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 125 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : Without Contact Size : 4 Contact Type : Pin Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1.27 MICM [50 MICIN ] Mating Pin Diameter : 6.35 MM [.25 INCH ] Wire Contact Termination Area Plating Material : Gold Wire Contact Termination Area Plating Thickness : .76 MICM [30 MICIN ]
Industry Standards Glow Wire Rating : Standard Part - Not Glow Wire
Mechanical Attachment Connector Mounting Type : Board Mount Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Package Packaging Quantity : 200
Product Type Features Connector & Contact Terminates To : Bus Bar Connector System : Wire-to-Board Power Contact Type : Contact
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Contact Features
Contact Base Material : Copper Alloy
Contact Current Rating (Max) (AMP) : 125
Contact Mating Area Plating Material : Gold
Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ]
Contact Orientation : Straight
Contact Retention Within Housing : Without
Contact Size : 4
Contact Type : Pin
Contact Underplating Material : Nickel
Contact Underplating Material Thickness : 1.27 MICM [50 MICIN ]
Mating Pin Diameter : 6.35 MM [.25 INCH ]
Wire Contact Termination Area Plating Material : Gold
