TE Connectivity Mini DIMM Sockets 1735438-1

Description
Body Features Center Post Material : Liquid Crystal Polymer (LCP) Ejector Location : Both Ends Ejector Material : Liquid Crystal Polymer (LCP) Ejector Material Color : Natural Ejector Type : Standard Hold-Down Material : Copper Alloy Latch Color : Natural Latch Material : Liquid Crystal Polymer (LCP) Module Key Type : Per JEDEC MO-244, Module Variation AB/BB/CB, Standard Orientation Retention Post Location : None Configuration Features Center Key : None Keying : Standard Module Orientation : Right Angle Number of Hold-Downs : 6 Number of Keys : 1 Number of Positions : 244 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Thickness (MICIN) : 30 Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Gold Flash Socket Style : Mini DIMM Socket Type : Memory Card Dimensions Center Retention Hole Diameter : 2.5 MM  [.098 INCH ] Height Above PC Board : 9.79 MM  [.385 INCH ] Row-to-Row Spacing : 8.7 MM  [.343 INCH ] Electrical Characteristics DRAM Voltage (V) : 1.5 Housing Features Centerline (Pitch) : .6 MM  [.024 INCH ] Hold-Down Plating Material : Tin Housing Color : Black Housing Material : LCP (Liquid Crystal Polymer) Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Locating Posts : With PCB Mount Retention : With PCB Mount Retention Type : Solder Peg PCB Mounting Style : Surface Mount Operation/Applicatio n Circuit Application : Power & Signal Packaging Features Packaging Method : Tray, Hard Tray Packaging Quantity : 15 Product Type Features Center Post : With Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board DRAM Type : Double Data Rate (DDR) 3 Product Type : Socket Profile : Standard Termination Features Insertion Style : Direct Insert Usage Conditions Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]
  • Mini DIMM Sockets - 1735438-1 - TE Connectivity
    TE Connectivity
  • Inline Module Sockets - A108912-ND - DigiKey
    DigiKey
  • Minidimm,r/a,1.8V,ddr2,rvs,30Au/aufl Amp - Te Connectivity - 75AC5870 - Newark, An Avnet Company
    Newark, An Avnet Company
Request a Quote Datasheet
Description
Body Features Center Post Material : Liquid Crystal Polymer (LCP) Ejector Location : Both Ends Ejector Material : Liquid Crystal Polymer (LCP) Ejector Material Color : Natural Ejector Type : Standard Hold-Down Material : Copper Alloy Latch Color : Natural Latch Material : Liquid Crystal Polymer (LCP) Module Key Type : Per JEDEC MO-244, Module Variation AB/BB/CB, Standard Orientation Retention Post Location : None Configuration Features Center Key : None Keying : Standard Module Orientation : Right Angle Number of Hold-Downs : 6 Number of Keys : 1 Number of Positions : 244 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Thickness (MICIN) : 30 Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Gold Flash Socket Style : Mini DIMM Socket Type : Memory Card Dimensions Center Retention Hole Diameter : 2.5 MM  [.098 INCH ] Height Above PC Board : 9.79 MM  [.385 INCH ] Row-to-Row Spacing : 8.7 MM  [.343 INCH ] Electrical Characteristics DRAM Voltage (V) : 1.5 Housing Features Centerline (Pitch) : .6 MM  [.024 INCH ] Hold-Down Plating Material : Tin Housing Color : Black Housing Material : LCP (Liquid Crystal Polymer) Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Locating Posts : With PCB Mount Retention : With PCB Mount Retention Type : Solder Peg PCB Mounting Style : Surface Mount Operation/Applicatio n Circuit Application : Power & Signal Packaging Features Packaging Method : Tray, Hard Tray Packaging Quantity : 15 Product Type Features Center Post : With Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board DRAM Type : Double Data Rate (DDR) 3 Product Type : Socket Profile : Standard Termination Features Insertion Style : Direct Insert Usage Conditions Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Mini DIMM Sockets - 1735438-1 - TE Connectivity
TE Connectivity
Berwyn, PA, United States
Mini DIMM Sockets
1735438-1
Mini DIMM Sockets 1735438-1
Body Features Center Post Material : Liquid Crystal Polymer (LCP) Ejector Location : Both Ends Ejector Material : Liquid Crystal Polymer (LCP) Ejector Material Color : Natural Ejector Type : Standard Hold-Down Material : Copper Alloy Latch Color : Natural Latch Material : Liquid Crystal Polymer (LCP) Module Key Type : Per JEDEC MO-244, Module Variation AB/BB/CB, Standard Orientation Retention Post Location : None Configuration Features Center Key : None Keying : Standard Module Orientation : Right Angle Number of Hold-Downs : 6 Number of Keys : 1 Number of Positions : 244 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Thickness (MICIN) : 30 Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Gold Flash Socket Style : Mini DIMM Socket Type : Memory Card Dimensions Center Retention Hole Diameter : 2.5 MM  [.098 INCH ] Height Above PC Board : 9.79 MM  [.385 INCH ] Row-to-Row Spacing : 8.7 MM  [.343 INCH ] Electrical Characteristics DRAM Voltage (V) : 1.5 Housing Features Centerline (Pitch) : .6 MM  [.024 INCH ] Hold-Down Plating Material : Tin Housing Color : Black Housing Material : LCP (Liquid Crystal Polymer) Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Locating Posts : With PCB Mount Retention : With PCB Mount Retention Type : Solder Peg PCB Mounting Style : Surface Mount Operation/Applicatio n Circuit Application : Power & Signal Packaging Features Packaging Method : Tray, Hard Tray Packaging Quantity : 15 Product Type Features Center Post : With Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board DRAM Type : Double Data Rate (DDR) 3 Product Type : Socket Profile : Standard Termination Features Insertion Style : Direct Insert Usage Conditions Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]

Body Features


  • Center Post Material : Liquid Crystal Polymer (LCP)
  • Ejector Location : Both Ends
  • Ejector Material : Liquid Crystal Polymer (LCP)
  • Ejector Material Color : Natural
  • Ejector Type : Standard
  • Hold-Down Material : Copper Alloy
  • Latch Color : Natural
  • Latch Material : Liquid Crystal Polymer (LCP)
  • Module Key Type : Per JEDEC MO-244, Module Variation AB/BB/CB, Standard Orientation
  • Retention Post Location : None

Configuration Features


  • Center Key : None
  • Keying : Standard
  • Module Orientation : Right Angle
  • Number of Hold-Downs : 6
  • Number of Keys : 1
  • Number of Positions : 244
  • Number of Rows : 2

Contact Features


  • Contact Base Material : Copper Alloy
  • Contact Current Rating (Max) (AMP) : 1
  • Contact Mating Area Plating Material : Gold
  • Contact Mating Area Plating Thickness (MICIN) : 30
  • Contact Underplating Material : Nickel
  • PCB Contact Termination Area Plating Material : Gold Flash
  • Socket Style : Mini DIMM
  • Socket Type : Memory Card

Dimensions


  • Center Retention Hole Diameter : 2.5 MM  [.098 INCH ]
  • Height Above PC Board : 9.79 MM  [.385 INCH ]
  • Row-to-Row Spacing : 8.7 MM  [.343 INCH ]

Electrical Characteristics


  • DRAM Voltage (V) : 1.5

Housing Features


  • Centerline (Pitch) : .6 MM  [.024 INCH ]
  • Hold-Down Plating Material : Tin
  • Housing Color : Black
  • Housing Material : LCP (Liquid Crystal Polymer)

Industry Standards


  • UL Flammability Rating : UL 94V-0

Mechanical Attachment


  • Connector Mounting Type : Board Mount
  • Locating Posts : With
  • PCB Mount Retention : With
  • PCB Mount Retention Type : Solder Peg
  • PCB Mounting Style : Surface Mount

Operation/Application


  • Circuit Application : Power & Signal

Packaging Features


  • Packaging Method : Tray, Hard Tray
  • Packaging Quantity : 15

Product Type Features


  • Center Post : With
  • Connector & Contact Terminates To : Printed Circuit Board
  • Connector System : Board-to-Board
  • DRAM Type : Double Data Rate (DDR) 3
  • Product Type : Socket
  • Profile : Standard

Termination Features


  • Insertion Style : Direct Insert

Usage Conditions


  • Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]
Buy Now
Inline Module Sockets - A108912-ND - DigiKey
DigiKey
Thief River Falls, MN, United States
Inline Module Sockets
A108912-ND
Inline Module Sockets A108912-ND
244 Position MiniDIMM DDR2 SDRAM Socket Surface Mount, Right Angle

244 Position MiniDIMM DDR2 SDRAM Socket Surface Mount, Right Angle

Buy Now Datasheet
Minidimm,r/a,1.8V,ddr2,rvs,30Au/aufl Amp - Te Connectivity - 75AC5870 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Minidimm,r/a,1.8V,ddr2,rvs,30Au/aufl Amp - Te Connectivity
75AC5870
Minidimm,r/a,1.8V,ddr2,rvs,30Au/aufl Amp - Te Connectivity 75AC5870
MiniDIMM,R/A,1.8V,DD R2,RVS,30Au/AuFl

MiniDIMM,R/A,1.8V,DDR2,RVS,30Au/AuFl

Supplier's Site

Technical Specifications

  TE Connectivity DigiKey Newark, An Avnet Company
Product Category Electrical Connectors Board Mount Connectors Electrical Connectors
Product Number 1735438-1 A108912-ND 75AC5870
Product Name Mini DIMM Sockets Inline Module Sockets Minidimm,r/a,1.8V,ddr2,rvs,30Au/aufl Amp - Te Connectivity
Connector Type Board to Board Connector
Unlock Full Specs
to access all available technical data