TE Connectivity SO DIMM Sockets 1735251-3

Description
Body Features Connector Profile : Standard Ejector Location : Both Ends Ejector Type : Locking Latch Material : Stainless Steel Latch Plating Material : Tin Module Key Type : SGRAM Configuration Features Module Orientation : Right Angle Number of Bays : 2 Number of Keys : 1 Number of Positions : 144 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .25 MICM  [9.84 MICIN ] Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Gold Dimensions Row-to-Row Spacing : 6.2 MM  [.244 INCH ] Stack Height : 5.2 MM  [.205 INCH ] Electrical Characteristics DRAM Voltage (V) : 1.8 Housing Features Centerline (Pitch) : .8 MM  [.031 INCH ] Housing Color : Black Housing Material : High Temperature Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment Type : Standard Keying PCB Mount Retention : With PCB Mount Retention Type : Hold-Down Post Operation/Applicatio n Circuit Application : Signal Packaging Features Packaging Method : Tray, Box Packaging Quantity : 240 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Cable-to-Board DRAM Type : Double Data Rate (DDR) 3 Signal Characteristics SGRAM Voltage (V) : 1.8 Termination Features Insertion Style : Cam-In Termination Method to PCB : Surface Mount Usage Conditions Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]
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Description
Body Features Connector Profile : Standard Ejector Location : Both Ends Ejector Type : Locking Latch Material : Stainless Steel Latch Plating Material : Tin Module Key Type : SGRAM Configuration Features Module Orientation : Right Angle Number of Bays : 2 Number of Keys : 1 Number of Positions : 144 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .25 MICM  [9.84 MICIN ] Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Gold Dimensions Row-to-Row Spacing : 6.2 MM  [.244 INCH ] Stack Height : 5.2 MM  [.205 INCH ] Electrical Characteristics DRAM Voltage (V) : 1.8 Housing Features Centerline (Pitch) : .8 MM  [.031 INCH ] Housing Color : Black Housing Material : High Temperature Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment Type : Standard Keying PCB Mount Retention : With PCB Mount Retention Type : Hold-Down Post Operation/Applicatio n Circuit Application : Signal Packaging Features Packaging Method : Tray, Box Packaging Quantity : 240 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Cable-to-Board DRAM Type : Double Data Rate (DDR) 3 Signal Characteristics SGRAM Voltage (V) : 1.8 Termination Features Insertion Style : Cam-In Termination Method to PCB : Surface Mount Usage Conditions Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]
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Suppliers

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Product
Description
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SO DIMM Sockets - 1735251-3 - TE Connectivity
Berwyn, PA, United States
SO DIMM Sockets
1735251-3
SO DIMM Sockets 1735251-3
Body Features Connector Profile : Standard Ejector Location : Both Ends Ejector Type : Locking Latch Material : Stainless Steel Latch Plating Material : Tin Module Key Type : SGRAM Configuration Features Module Orientation : Right Angle Number of Bays : 2 Number of Keys : 1 Number of Positions : 144 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .25 MICM  [9.84 MICIN ] Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Gold Dimensions Row-to-Row Spacing : 6.2 MM  [.244 INCH ] Stack Height : 5.2 MM  [.205 INCH ] Electrical Characteristics DRAM Voltage (V) : 1.8 Housing Features Centerline (Pitch) : .8 MM  [.031 INCH ] Housing Color : Black Housing Material : High Temperature Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment Type : Standard Keying PCB Mount Retention : With PCB Mount Retention Type : Hold-Down Post Operation/Applicatio n Circuit Application : Signal Packaging Features Packaging Method : Tray, Box Packaging Quantity : 240 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Cable-to-Board DRAM Type : Double Data Rate (DDR) 3 Signal Characteristics SGRAM Voltage (V) : 1.8 Termination Features Insertion Style : Cam-In Termination Method to PCB : Surface Mount Usage Conditions Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]

Body Features


  • Connector Profile : Standard
  • Ejector Location : Both Ends
  • Ejector Type : Locking
  • Latch Material : Stainless Steel
  • Latch Plating Material : Tin
  • Module Key Type : SGRAM

Configuration Features


  • Module Orientation : Right Angle
  • Number of Bays : 2
  • Number of Keys : 1
  • Number of Positions : 144
  • Number of Rows : 2

Contact Features


  • Contact Base Material : Copper Alloy
  • Contact Mating Area Plating Material : Gold (Au)
  • Contact Mating Area Plating Material Thickness : .25 MICM  [9.84 MICIN ]
  • Memory Socket Type : Memory Card
  • PCB Contact Termination Area Plating Material : Gold

Dimensions


  • Row-to-Row Spacing : 6.2 MM  [.244 INCH ]
  • Stack Height : 5.2 MM  [.205 INCH ]

Electrical Characteristics


  • DRAM Voltage (V) : 1.8

Housing Features


  • Centerline (Pitch) : .8 MM  [.031 INCH ]
  • Housing Color : Black
  • Housing Material : High Temperature Thermoplastic

Industry Standards


  • UL Flammability Rating : UL 94V-0

Mechanical Attachment


  • Connector Mounting Type : Board Mount
  • Mating Alignment Type : Standard Keying
  • PCB Mount Retention : With
  • PCB Mount Retention Type : Hold-Down Post

Operation/Application


  • Circuit Application : Signal

Packaging Features


  • Packaging Method : Tray, Box
  • Packaging Quantity : 240

Product Type Features


  • Connector & Contact Terminates To : Printed Circuit Board
  • Connector System : Cable-to-Board
  • DRAM Type : Double Data Rate (DDR) 3

Signal Characteristics


  • SGRAM Voltage (V) : 1.8

Termination Features


  • Insertion Style : Cam-In
  • Termination Method to PCB : Surface Mount

Usage Conditions


  • Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]
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Headers & Wire Housings - 1735251-3 - Powell Electronics, Inc.
Swedesboro, NJ, United States
Headers & Wire Housings
1735251-3
Headers & Wire Housings 1735251-3
SKT,SODIMM,144P,1.5/ 1.35V(DDR3),STD,TY-S

SKT,SODIMM,144P,1.5/1.35V(DDR3),STD,TY-S

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Technical Specifications

  TE Connectivity Powell Electronics, Inc.
Product Category IC Interconnect Components IC Interconnect Components
Product Number 1735251-3 1735251-3
Product Name SO DIMM Sockets Headers & Wire Housings
Product Type IC Socket IC Headers
Socket Type DIMM DIMM
Mounting SMT; Board Mount
Voltage Rating 1.8 volts
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