TE Connectivity SO DIMM Sockets 1717468-3

Description
Body Features Connector Profile : Standard Ejector Location : Both Ends Ejector Type : Locking Latch Material : Stainless Steel Module Key Type : SGRAM Configuration Features Module Orientation : Right Angle Number of Bays : 2 Number of Keys : 1 Number of Positions : 200 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold Flash Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Gold Flash Dimensions Row-to-Row Spacing : 6.2 MM  [.244 INCH ] Stack Height : 6.5 MM  [.256 INCH ] Electrical Characteristics DRAM Voltage (V) : 2.5 Housing Features Centerline (Pitch) : .6 MM  [.024 INCH ] Housing Color : Black Housing Material : High Temperature Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment Type : Standard Keying PCB Mount Retention : With PCB Mount Retention Type : Solder Peg Operation/Applicatio n Circuit Application : Power Packaging Features Packaging Method : Tray, Semi-Hard Tray Assembly Packaging Quantity : 20 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Cable-to-Board DRAM Type : Double Data Rate (DDR) Signal Characteristics SGRAM Voltage (V) : 2.5 Termination Features Insertion Style : Cam-In Termination Method to PCB : Surface Mount Usage Conditions Operating Temperature Range : -55 - 85 DEGC  [-67 - 185 DEGF ]
  • SO DIMM Sockets - 1717468-3 - TE Connectivity
    TE Connectivity
  • Headers & Wire Housings - 1717468-3 - Powell Electronics, Inc.
    Powell Electronics, Inc.
  • IC and Component Socket - 1717468-3 - Richardson RFPD
    Richardson RFPD
Request a Quote Datasheet
Description
Body Features Connector Profile : Standard Ejector Location : Both Ends Ejector Type : Locking Latch Material : Stainless Steel Module Key Type : SGRAM Configuration Features Module Orientation : Right Angle Number of Bays : 2 Number of Keys : 1 Number of Positions : 200 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold Flash Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Gold Flash Dimensions Row-to-Row Spacing : 6.2 MM  [.244 INCH ] Stack Height : 6.5 MM  [.256 INCH ] Electrical Characteristics DRAM Voltage (V) : 2.5 Housing Features Centerline (Pitch) : .6 MM  [.024 INCH ] Housing Color : Black Housing Material : High Temperature Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment Type : Standard Keying PCB Mount Retention : With PCB Mount Retention Type : Solder Peg Operation/Applicatio n Circuit Application : Power Packaging Features Packaging Method : Tray, Semi-Hard Tray Assembly Packaging Quantity : 20 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Cable-to-Board DRAM Type : Double Data Rate (DDR) Signal Characteristics SGRAM Voltage (V) : 2.5 Termination Features Insertion Style : Cam-In Termination Method to PCB : Surface Mount Usage Conditions Operating Temperature Range : -55 - 85 DEGC  [-67 - 185 DEGF ]
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
SO DIMM Sockets - 1717468-3 - TE Connectivity
TE Connectivity
Berwyn, PA, United States
SO DIMM Sockets
1717468-3
SO DIMM Sockets 1717468-3
Body Features Connector Profile : Standard Ejector Location : Both Ends Ejector Type : Locking Latch Material : Stainless Steel Module Key Type : SGRAM Configuration Features Module Orientation : Right Angle Number of Bays : 2 Number of Keys : 1 Number of Positions : 200 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold Flash Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Gold Flash Dimensions Row-to-Row Spacing : 6.2 MM  [.244 INCH ] Stack Height : 6.5 MM  [.256 INCH ] Electrical Characteristics DRAM Voltage (V) : 2.5 Housing Features Centerline (Pitch) : .6 MM  [.024 INCH ] Housing Color : Black Housing Material : High Temperature Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment Type : Standard Keying PCB Mount Retention : With PCB Mount Retention Type : Solder Peg Operation/Applicatio n Circuit Application : Power Packaging Features Packaging Method : Tray, Semi-Hard Tray Assembly Packaging Quantity : 20 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Cable-to-Board DRAM Type : Double Data Rate (DDR) Signal Characteristics SGRAM Voltage (V) : 2.5 Termination Features Insertion Style : Cam-In Termination Method to PCB : Surface Mount Usage Conditions Operating Temperature Range : -55 - 85 DEGC  [-67 - 185 DEGF ]

Body Features


  • Connector Profile : Standard
  • Ejector Location : Both Ends
  • Ejector Type : Locking
  • Latch Material : Stainless Steel
  • Module Key Type : SGRAM

Configuration Features


  • Module Orientation : Right Angle
  • Number of Bays : 2
  • Number of Keys : 1
  • Number of Positions : 200
  • Number of Rows : 2

Contact Features


  • Contact Base Material : Copper Alloy
  • Contact Current Rating (Max) (AMP) : .5
  • Contact Mating Area Plating Material : Gold Flash
  • Memory Socket Type : Memory Card
  • PCB Contact Termination Area Plating Material : Gold Flash

Dimensions


  • Row-to-Row Spacing : 6.2 MM  [.244 INCH ]
  • Stack Height : 6.5 MM  [.256 INCH ]

Electrical Characteristics


  • DRAM Voltage (V) : 2.5

Housing Features


  • Centerline (Pitch) : .6 MM  [.024 INCH ]
  • Housing Color : Black
  • Housing Material : High Temperature Thermoplastic

Industry Standards


  • UL Flammability Rating : UL 94V-0

Mechanical Attachment


  • Connector Mounting Type : Board Mount
  • Mating Alignment Type : Standard Keying
  • PCB Mount Retention : With
  • PCB Mount Retention Type : Solder Peg

Operation/Application


  • Circuit Application : Power

Packaging Features


  • Packaging Method : Tray, Semi-Hard Tray Assembly
  • Packaging Quantity : 20

Product Type Features


  • Connector & Contact Terminates To : Printed Circuit Board
  • Connector System : Cable-to-Board
  • DRAM Type : Double Data Rate (DDR)

Signal Characteristics


  • SGRAM Voltage (V) : 2.5

Termination Features


  • Insertion Style : Cam-In
  • Termination Method to PCB : Surface Mount

Usage Conditions


  • Operating Temperature Range : -55 - 85 DEGC  [-67 - 185 DEGF ]
Buy Now
Headers & Wire Housings - 1717468-3 - Powell Electronics, Inc.
Powell Electronics, Inc.
Swedesboro, NJ, United States
Headers & Wire Housings
1717468-3
Headers & Wire Housings 1717468-3
SEMI-HARD TRAY DDR SODIMM SOCKET 200P 6

SEMI-HARD TRAY DDR SODIMM SOCKET 200P 6

Buy Now
IC and Component Socket - 1717468-3 - Richardson RFPD
Richardson RFPD
Downers Grove, IL, United States
IC and Component Socket
1717468-3
IC and Component Socket 1717468-3
Memory Sockets

Memory Sockets

Supplier's Site Datasheet

Technical Specifications

  TE Connectivity Powell Electronics, Inc. Richardson RFPD
Product Category IC Interconnect Components IC Interconnect Components IC Interconnect Components
Product Number 1717468-3 1717468-3 1717468-3
Product Name SO DIMM Sockets Headers & Wire Housings IC and Component Socket
Product Type IC Socket IC Socket; IC Headers
Socket Type DIMM DIMM
Mounting SMT; Board Mount SMT; Solder
Voltage Rating 2.5 volts 2.5 volts
Current Rating 0.5000 amps
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