Contact Features Contact Base Material : Phosphor Bronze Contact Length : 22.2 MM [.87 INCH ] Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICM) : 1.25 Contact Retention Within Housing : With
Dimensions Compatible Insulation Diameter Range (INCH) : 1.1 - 1.8
Mechanical Attachment Contact Retention Type Within Housing : Snap-In
Operation/Applicatio
n Circuit Application : Signal Solder Process Feature : Solder Dipped
Packaging Features Packaging Method : Strip
Termination Features Product Terminates To : Wire & Cable
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
TE Connectivity
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Description
Contact Features Contact Base Material : Phosphor Bronze Contact Length : 22.2 MM [.87 INCH ] Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICM) : 1.25 Contact Retention Within Housing : With
Dimensions Compatible Insulation Diameter Range (INCH) : 1.1 - 1.8
Mechanical Attachment Contact Retention Type Within Housing : Snap-In
Operation/Applicatio
n Circuit Application : Signal Solder Process Feature : Solder Dipped
Packaging Features Packaging Method : Strip
Termination Features Product Terminates To : Wire & Cable
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
Contact Features Contact Base Material : Phosphor Bronze Contact Length : 22.2 MM [.87 INCH ] Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICM) : 1.25 Contact Retention Within Housing : With
Dimensions Compatible Insulation Diameter Range (INCH) : 1.1 - 1.8
Mechanical Attachment Contact Retention Type Within Housing : Snap-In
Operation/Applicatio
n Circuit Application : Signal Solder Process Feature : Solder Dipped
Packaging Features Packaging Method : Strip
Termination Features Product Terminates To : Wire & Cable
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
Contact Features
Contact Base Material : Phosphor Bronze
Contact Length : 22.2 MM [.87 INCH ]
Contact Mating Area Plating Material : Gold
Contact Mating Area Plating Material Thickness (MICM) : 1.25
Contact Retention Within Housing : With
Dimensions
Compatible Insulation Diameter Range (INCH) : 1.1 - 1.8
Mechanical Attachment
Contact Retention Type Within Housing : Snap-In
Operation/Application
Circuit Application : Signal
Solder Process Feature : Solder Dipped
Packaging Features
Packaging Method : Strip
Termination Features
Product Terminates To : Wire & Cable
Usage Conditions
Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
