TE Connectivity Connector Contacts 1650283-1

Contact Features Contact Base Material : Copper Contact Current Rating (Max) (AMP) : 5 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .76 MICM  [30 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : Without Contact Size : Size 20 Contact Type : Pin Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1 MICM  [40 MICIN ] Mating Pin Diameter : 1.02 MM  [.04 INCH ] PCB Contact Termination Area Plating Material : Gold PCB Contact Termination Area Plating Material Thickness : .76 MICM  [30 MICIN ] Dimensions Wire Size (AWG) : 24 - 20 Mechanical Attachment Wire Insulation Support : Without Operation/Applicatio n Circuit Application : Power Packaging Features Packaging Method : Tray Packaging Quantity : 1000 Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder Usage Conditions Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]