Contact Features Contact Base Material : Brass Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : With Contact Type : Pin Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1 MICM [40 MICIN ] Mating Pin Diameter : 2.38 MM [.094 INCH ] PCB Contact Termination Area Plating Material : Gold PCB Contact Termination Area Plating Material Thickness : .76 MICM [30 MICIN ] Wire Contact Termination Area Plating Material : Gold
Dimensions Wire Size (AWG) : 12
Mechanical Attachment Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Bag
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
TE Connectivity
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Description
Contact Features Contact Base Material : Brass Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : With Contact Type : Pin Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1 MICM [40 MICIN ] Mating Pin Diameter : 2.38 MM [.094 INCH ] PCB Contact Termination Area Plating Material : Gold PCB Contact Termination Area Plating Material Thickness : .76 MICM [30 MICIN ] Wire Contact Termination Area Plating Material : Gold
Dimensions Wire Size (AWG) : 12
Mechanical Attachment Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Bag
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
Contact Features Contact Base Material : Brass Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : With Contact Type : Pin Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1 MICM [40 MICIN ] Mating Pin Diameter : 2.38 MM [.094 INCH ] PCB Contact Termination Area Plating Material : Gold PCB Contact Termination Area Plating Material Thickness : .76 MICM [30 MICIN ] Wire Contact Termination Area Plating Material : Gold
Dimensions Wire Size (AWG) : 12
Mechanical Attachment Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Bag
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
Contact Features
Contact Base Material : Brass
Contact Mating Area Plating Material : Gold
Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ]
Contact Orientation : Straight
Contact Retention Within Housing : With
Contact Type : Pin
Contact Underplating Material : Nickel
Contact Underplating Material Thickness : 1 MICM [40 MICIN ]
Mating Pin Diameter : 2.38 MM [.094 INCH ]
PCB Contact Termination Area Plating Material : Gold
PCB Contact Termination Area Plating Material Thickness : .76 MICM [30 MICIN ]
Wire Contact Termination Area Plating Material : Gold
Dimensions
Wire Size (AWG) : 12
Mechanical Attachment
Wire Insulation Support : Without
Operation/Application
Circuit Application : Power
Packaging Features
Packaging Method : Bag
Termination Features
Product Terminates To : Printed Circuit Board
Termination Method to PCB : Through Hole - Solder
Usage Conditions
Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
