Contact Features Contact Base Material : Brass Alloy Contact Current Rating (Max) (AMP) : 5 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Finish : Bright Contact Mating Area Plating Material Thickness : .76 MICM [29.8 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : Without Contact Size : Size 20 Contact Type : Socket Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1 MICM [40 MICIN ] Mating Pin Diameter : 1.02 MM [.04 INCH ] PCB Contact Termination Area Plating Material : Gold PCB Contact Termination Area Plating Material Thickness : .25 MICM [10 MICIN ] Wire Contact Termination Area Plating Material : Gold Wire Contact Termination Area Plating Material Finish : Bright Wire Contact Termination Area Plating Thickness : .25 MICM [10 MICIN ]
Dimensions Wire Size (MMSQ) : .518 Wire Size (AWG) : 20 Wire Size (CMA) : 1023.9
Electrical Characteristics Operating Voltage (VAC) : 250
Mechanical Attachment Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Bag Packaging Quantity : 1000
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
Contact Features
- Contact Base Material : Brass Alloy
- Contact Current Rating (Max) (AMP) : 5
- Contact Mating Area Plating Material : Gold (Au)
- Contact Mating Area Plating Material Finish : Bright
- Contact Mating Area Plating Material Thickness : .76 MICM [29.8 MICIN ]
- Contact Orientation : Straight
- Contact Retention Within Housing : Without
- Contact Size : Size 20
- Contact Type : Socket
- Contact Underplating Material : Nickel
- Contact Underplating Material Thickness : 1 MICM [40 MICIN ]
- Mating Pin Diameter : 1.02 MM [.04 INCH ]
- PCB Contact Termination Area Plating Material : Gold
- PCB Contact Termination Area Plating Material Thickness : .25 MICM [10 MICIN ]
- Wire Contact Termination Area Plating Material : Gold
- Wire Contact Termination Area Plating Material Finish : Bright
- Wire Contact Termination Area Plating Thickness : .25 MICM [10 MICIN ]
Dimensions
- Wire Size (MMSQ) : .518
- Wire Size (AWG) : 20
- Wire Size (CMA) : 1023.9
Electrical Characteristics
- Operating Voltage (VAC) : 250
Mechanical Attachment
- Wire Insulation Support : Without
Operation/Application
- Circuit Application : Power
Packaging Features
- Packaging Method : Bag
- Packaging Quantity : 1000
Termination Features
- Product Terminates To : Printed Circuit Board
- Termination Method to PCB : Through Hole - Solder
Usage Conditions
- Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
