Contact Features Contact Base Material : Copper Alloy Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness (MICIN) : 30 Contact Orientation : Straight Contact Size : Size 20 Contact Type : Socket Wire Contact Termination Area Plating Material : Tin Wire Contact Termination Area Plating Material Finish : Bright Wire Contact Termination Area Plating Thickness : 1.01 MICM [40 MICIN ]
Dimensions Compatible Insulation Diameter Range : 1.57 MM [.063 INCH ] Wire Size (MMSQ) : .2 - .6 Wire Size (AWG) : 24 - 20
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Bag Packaging Quantity : 100
Product Type Features Discrete Wire Type : Stranded, Solid
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Crimp
TE Connectivity
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Description
Contact Features Contact Base Material : Copper Alloy Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness (MICIN) : 30 Contact Orientation : Straight Contact Size : Size 20 Contact Type : Socket Wire Contact Termination Area Plating Material : Tin Wire Contact Termination Area Plating Material Finish : Bright Wire Contact Termination Area Plating Thickness : 1.01 MICM [40 MICIN ]
Dimensions Compatible Insulation Diameter Range : 1.57 MM [.063 INCH ] Wire Size (MMSQ) : .2 - .6 Wire Size (AWG) : 24 - 20
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Bag Packaging Quantity : 100
Product Type Features Discrete Wire Type : Stranded, Solid
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Crimp
Contact Features Contact Base Material : Copper Alloy Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness (MICIN) : 30 Contact Orientation : Straight Contact Size : Size 20 Contact Type : Socket Wire Contact Termination Area Plating Material : Tin Wire Contact Termination Area Plating Material Finish : Bright Wire Contact Termination Area Plating Thickness : 1.01 MICM [40 MICIN ]
Dimensions Compatible Insulation Diameter Range : 1.57 MM [.063 INCH ] Wire Size (MMSQ) : .2 - .6 Wire Size (AWG) : 24 - 20
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Bag Packaging Quantity : 100
Product Type Features Discrete Wire Type : Stranded, Solid
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Crimp
Contact Features
Contact Base Material : Copper Alloy
Contact Mating Area Plating Material : Gold (Au)
Contact Mating Area Plating Material Thickness (MICIN) : 30
Contact Orientation : Straight
Contact Size : Size 20
Contact Type : Socket
Wire Contact Termination Area Plating Material : Tin
Wire Contact Termination Area Plating Material Finish : Bright
