Body Features Leadframe Clip Length : 1.4 MM [.055 INCH ] Leadframe Clip Type : E2 Leadframe Hold-Down Feature : Without Leadframe Thickness : .25 MM [.01 INCH ] Leadframe Width : 15.7 MM [.618 INCH ]
Configuration Features Solder Inlay : With Solder Technology : Inlay Winding Direction : Left
Contact Features Contact Base Material : Phosphor Bronze Leadframe Plating Material : Post Plated - Tin-Lead
Dimensions Leadframe Gap Size : .5 MM [.02 INCH ] PCB Thickness (Accepted) : .63 MM [.025 INCH ] Standoff Height : 2.3 MM [.09 INCH ]
Housing Features Centerline (Pitch) : 1.27 MM [.05 INCH ]
Mechanical Attachment Connector Mounting Type : Board Mount
Other Solder Type : Sn62/Pb36/Ag2
Packaging Features Packaging Quantity : 60000
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board Leadframe Type : Dual-In-Line (DIL)
Termination Features Termination Method to Printed Circuit Board : Surface Mount
Usage Conditions Solder Melting Point (DEGC) : 175
TE Connectivity
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Description
Body Features Leadframe Clip Length : 1.4 MM [.055 INCH ] Leadframe Clip Type : E2 Leadframe Hold-Down Feature : Without Leadframe Thickness : .25 MM [.01 INCH ] Leadframe Width : 15.7 MM [.618 INCH ]
Configuration Features Solder Inlay : With Solder Technology : Inlay Winding Direction : Left
Contact Features Contact Base Material : Phosphor Bronze Leadframe Plating Material : Post Plated - Tin-Lead
Dimensions Leadframe Gap Size : .5 MM [.02 INCH ] PCB Thickness (Accepted) : .63 MM [.025 INCH ] Standoff Height : 2.3 MM [.09 INCH ]
Housing Features Centerline (Pitch) : 1.27 MM [.05 INCH ]
Mechanical Attachment Connector Mounting Type : Board Mount
Other Solder Type : Sn62/Pb36/Ag2
Packaging Features Packaging Quantity : 60000
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board Leadframe Type : Dual-In-Line (DIL)
Termination Features Termination Method to Printed Circuit Board : Surface Mount
Usage Conditions Solder Melting Point (DEGC) : 175
Body Features Leadframe Clip Length : 1.4 MM [.055 INCH ] Leadframe Clip Type : E2 Leadframe Hold-Down Feature : Without Leadframe Thickness : .25 MM [.01 INCH ] Leadframe Width : 15.7 MM [.618 INCH ]
Configuration Features Solder Inlay : With Solder Technology : Inlay Winding Direction : Left
Contact Features Contact Base Material : Phosphor Bronze Leadframe Plating Material : Post Plated - Tin-Lead
Dimensions Leadframe Gap Size : .5 MM [.02 INCH ] PCB Thickness (Accepted) : .63 MM [.025 INCH ] Standoff Height : 2.3 MM [.09 INCH ]
Housing Features Centerline (Pitch) : 1.27 MM [.05 INCH ]
Mechanical Attachment Connector Mounting Type : Board Mount
Other Solder Type : Sn62/Pb36/Ag2
Packaging Features Packaging Quantity : 60000
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board Leadframe Type : Dual-In-Line (DIL)
Termination Features Termination Method to Printed Circuit Board : Surface Mount
Usage Conditions Solder Melting Point (DEGC) : 175
Body Features
Leadframe Clip Length : 1.4 MM [.055 INCH ]
Leadframe Clip Type : E2
Leadframe Hold-Down Feature : Without
Leadframe Thickness : .25 MM [.01 INCH ]
Leadframe Width : 15.7 MM [.618 INCH ]
Configuration Features
Solder Inlay : With
Solder Technology : Inlay
Winding Direction : Left
Contact Features
Contact Base Material : Phosphor Bronze
Leadframe Plating Material : Post Plated - Tin-Lead
Dimensions
Leadframe Gap Size : .5 MM [.02 INCH ]
PCB Thickness (Accepted) : .63 MM [.025 INCH ]
Standoff Height : 2.3 MM [.09 INCH ]
Housing Features
Centerline (Pitch) : 1.27 MM [.05 INCH ]
Mechanical Attachment
Connector Mounting Type : Board Mount
Other
Solder Type : Sn62/Pb36/Ag2
Packaging Features
Packaging Quantity : 60000
Product Type Features
Connector & Contact Terminates To : Printed Circuit Board
Connector System : Board-to-Board
Leadframe Type : Dual-In-Line (DIL)
Termination Features
Termination Method to Printed Circuit Board : Surface Mount
