Contact Features Contact Base Material : Brass Contact Current Rating (Max) (AMP) : 40 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ] Contact Orientation : Right Angle Contact Type : Socket Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin-Lead PCB Contact Termination Area Plating Material Thickness : 2.54 MICM [100 MICIN ]
Mechanical Attachment PCB Mount Retention : Without Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Tray Packaging Quantity : 1
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
TE Connectivity
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Description
Contact Features Contact Base Material : Brass Contact Current Rating (Max) (AMP) : 40 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ] Contact Orientation : Right Angle Contact Type : Socket Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin-Lead PCB Contact Termination Area Plating Material Thickness : 2.54 MICM [100 MICIN ]
Mechanical Attachment PCB Mount Retention : Without Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Tray Packaging Quantity : 1
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
Contact Features Contact Base Material : Brass Contact Current Rating (Max) (AMP) : 40 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ] Contact Orientation : Right Angle Contact Type : Socket Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin-Lead PCB Contact Termination Area Plating Material Thickness : 2.54 MICM [100 MICIN ]
Mechanical Attachment PCB Mount Retention : Without Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Tray Packaging Quantity : 1
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
Contact Features
Contact Base Material : Brass
Contact Current Rating (Max) (AMP) : 40
Contact Mating Area Plating Material : Gold (Au)
Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ]
Contact Orientation : Right Angle
Contact Type : Socket
Contact Underplating Material : Nickel
PCB Contact Termination Area Plating Material : Tin-Lead
PCB Contact Termination Area Plating Material Thickness : 2.54 MICM [100 MICIN ]
Mechanical Attachment
PCB Mount Retention : Without
Wire Insulation Support : Without
Operation/Application
Circuit Application : Power
Packaging Features
Packaging Method : Tray
Packaging Quantity : 1
Termination Features
Product Terminates To : Printed Circuit Board
Termination Method to PCB : Through Hole - Solder
Usage Conditions
Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
