Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 3 Contact Length : 16.1 MM [.634 INCH ] Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .76 MICM [29.921 MICIN ] Contact Type : Socket Contact Underplating Material : Nickel
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Bag
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
TE Connectivity
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Description
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 3 Contact Length : 16.1 MM [.634 INCH ] Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .76 MICM [29.921 MICIN ] Contact Type : Socket Contact Underplating Material : Nickel
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Bag
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 3 Contact Length : 16.1 MM [.634 INCH ] Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .76 MICM [29.921 MICIN ] Contact Type : Socket Contact Underplating Material : Nickel
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Bag
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Contact Features
Contact Base Material : Copper Alloy
Contact Current Rating (Max) (AMP) : 3
Contact Length : 16.1 MM [.634 INCH ]
Contact Mating Area Plating Material : Gold (Au)
Contact Mating Area Plating Material Thickness : .76 MICM [29.921 MICIN ]
Contact Type : Socket
Contact Underplating Material : Nickel
Operation/Application
Circuit Application : Power
Packaging Features
Packaging Method : Bag
Termination Features
Product Terminates To : Printed Circuit Board
Termination Method to PCB : Through Hole - Solder
Usage Conditions
Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
