TE Connectivity Headers, Male Pins 147779-1

The TE Connectivity AMPMODU MTE interconnect system is designed for wire-to-board and wire-to-wire applications, suitable for various electronic equipment including medical instruments, automotive controls, and computers. This specific product features insulation displacement contacts (IDC) or crimp snap-in contacts, providing flexibility in assembly design with options for latching and polarization. The product supports a current rating of up to 3 amps per contact in free air and operates within a temperature range of -65¬8C to +105¬8C. It accommodates wire sizes from AWG 20 to AWG 32 for crimp configurations and AWG 22 to AWG 30 for IDC configurations. The connectors are available in multiple plating options, including gold and matte tin, and can be configured in sizes ranging from 2 to 25 positions, with double row coupling shrouds allowing for up to 50 positions. This product is RoHS compliant and is applicable in a wide range of industries, making it a versatile choice for engineers seeking reliable interconnect solutions.