TE Connectivity SO DIMM Sockets 1473150-6

Description
Body Features Connector Profile : Standard Ejector Location : Both Ends Ejector Type : Locking Latch Material : Stainless Steel Latch Plating Material : Tin Module Key Type : SGRAM Configuration Features Center Key : None Keying : Reverse Module Orientation : Right Angle Number of Bays : 2 Number of Keys : 1 Number of Positions : 200 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold PCB Contact Termination Area Plating Material : Gold Flash Socket Style : SO DIMM Socket Type : Memory Card Dimensions Row-to-Row Spacing : 6.2 MM  [.244 INCH ] Stack Height : 5.2 MM  [.205 INCH ] Electrical Characteristics DRAM Voltage (V) : 1.8 Housing Features Centerline (Pitch) : .6 MM  [.024 INCH ] Housing Color : Black Housing Material : High Temperature Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount PCB Mount Retention : With PCB Mount Retention Type : Solder Peg PCB Mounting Style : Surface Mount Operation/Applicatio n Circuit Application : Power Packaging Features Packaging Method : Box, Tray Packaging Quantity : 20 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Cable-to-Board DRAM Type : Double Data Rate (DDR) 2 Product Type : Socket Sealable : No Signal Characteristics SGRAM Voltage (V) : 1.8 Termination Features Insertion Style : Cam-In Usage Conditions Operating Temperature Range : -55 - 85 DEGC  [-67 - 185 DEGF ]
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Description
Body Features Connector Profile : Standard Ejector Location : Both Ends Ejector Type : Locking Latch Material : Stainless Steel Latch Plating Material : Tin Module Key Type : SGRAM Configuration Features Center Key : None Keying : Reverse Module Orientation : Right Angle Number of Bays : 2 Number of Keys : 1 Number of Positions : 200 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold PCB Contact Termination Area Plating Material : Gold Flash Socket Style : SO DIMM Socket Type : Memory Card Dimensions Row-to-Row Spacing : 6.2 MM  [.244 INCH ] Stack Height : 5.2 MM  [.205 INCH ] Electrical Characteristics DRAM Voltage (V) : 1.8 Housing Features Centerline (Pitch) : .6 MM  [.024 INCH ] Housing Color : Black Housing Material : High Temperature Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount PCB Mount Retention : With PCB Mount Retention Type : Solder Peg PCB Mounting Style : Surface Mount Operation/Applicatio n Circuit Application : Power Packaging Features Packaging Method : Box, Tray Packaging Quantity : 20 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Cable-to-Board DRAM Type : Double Data Rate (DDR) 2 Product Type : Socket Sealable : No Signal Characteristics SGRAM Voltage (V) : 1.8 Termination Features Insertion Style : Cam-In Usage Conditions Operating Temperature Range : -55 - 85 DEGC  [-67 - 185 DEGF ]
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Suppliers

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Product
Description
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SO DIMM Sockets - 1473150-6 - TE Connectivity
Berwyn, PA, United States
SO DIMM Sockets
1473150-6
SO DIMM Sockets 1473150-6
Body Features Connector Profile : Standard Ejector Location : Both Ends Ejector Type : Locking Latch Material : Stainless Steel Latch Plating Material : Tin Module Key Type : SGRAM Configuration Features Center Key : None Keying : Reverse Module Orientation : Right Angle Number of Bays : 2 Number of Keys : 1 Number of Positions : 200 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold PCB Contact Termination Area Plating Material : Gold Flash Socket Style : SO DIMM Socket Type : Memory Card Dimensions Row-to-Row Spacing : 6.2 MM  [.244 INCH ] Stack Height : 5.2 MM  [.205 INCH ] Electrical Characteristics DRAM Voltage (V) : 1.8 Housing Features Centerline (Pitch) : .6 MM  [.024 INCH ] Housing Color : Black Housing Material : High Temperature Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount PCB Mount Retention : With PCB Mount Retention Type : Solder Peg PCB Mounting Style : Surface Mount Operation/Applicatio n Circuit Application : Power Packaging Features Packaging Method : Box, Tray Packaging Quantity : 20 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Cable-to-Board DRAM Type : Double Data Rate (DDR) 2 Product Type : Socket Sealable : No Signal Characteristics SGRAM Voltage (V) : 1.8 Termination Features Insertion Style : Cam-In Usage Conditions Operating Temperature Range : -55 - 85 DEGC  [-67 - 185 DEGF ]

Body Features


  • Connector Profile : Standard
  • Ejector Location : Both Ends
  • Ejector Type : Locking
  • Latch Material : Stainless Steel
  • Latch Plating Material : Tin
  • Module Key Type : SGRAM

Configuration Features


  • Center Key : None
  • Keying : Reverse
  • Module Orientation : Right Angle
  • Number of Bays : 2
  • Number of Keys : 1
  • Number of Positions : 200
  • Number of Rows : 2

Contact Features


  • Contact Base Material : Copper Alloy
  • Contact Current Rating (Max) (AMP) : .5
  • Contact Mating Area Plating Material : Gold
  • PCB Contact Termination Area Plating Material : Gold Flash
  • Socket Style : SO DIMM
  • Socket Type : Memory Card

Dimensions


  • Row-to-Row Spacing : 6.2 MM  [.244 INCH ]
  • Stack Height : 5.2 MM  [.205 INCH ]

Electrical Characteristics


  • DRAM Voltage (V) : 1.8

Housing Features


  • Centerline (Pitch) : .6 MM  [.024 INCH ]
  • Housing Color : Black
  • Housing Material : High Temperature Thermoplastic

Industry Standards


  • UL Flammability Rating : UL 94V-0

Mechanical Attachment


  • Connector Mounting Type : Board Mount
  • PCB Mount Retention : With
  • PCB Mount Retention Type : Solder Peg
  • PCB Mounting Style : Surface Mount

Operation/Application


  • Circuit Application : Power

Packaging Features


  • Packaging Method : Box, Tray
  • Packaging Quantity : 20

Product Type Features


  • Connector & Contact Terminates To : Printed Circuit Board
  • Connector System : Cable-to-Board
  • DRAM Type : Double Data Rate (DDR) 2
  • Product Type : Socket
  • Sealable : No

Signal Characteristics


  • SGRAM Voltage (V) : 1.8

Termination Features


  • Insertion Style : Cam-In

Usage Conditions


  • Operating Temperature Range : -55 - 85 DEGC  [-67 - 185 DEGF ]
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Technical Specifications

  TE Connectivity
Product Category IC Interconnect Components
Product Number 1473150-6
Product Name SO DIMM Sockets
Product Type IC Socket
Socket Type DIMM
Mounting SMT; Board Mount
Voltage Rating 1.8 volts
Current Rating 0.5000 amps
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