Body Features Connector Profile : Standard Ejector Location : Both Ends Ejector Type : Locking Latch Material : Stainless Steel Latch Plating Material : Tin Module Key Type : SGRAM
Configuration Features Center Key : None Keying : Reverse Module Orientation : Right Angle Number of Bays : 2 Number of Keys : 1 Number of Positions : 200 Number of Rows : 2
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold PCB Contact Termination Area Plating Material : Gold Flash Socket Style : SO DIMM Socket Type : Memory Card
Dimensions Row-to-Row Spacing : 6.2 MM [.244 INCH ] Stack Height : 5.2 MM [.205 INCH ]
Electrical Characteristics DRAM Voltage (V) : 1.8
Housing Features Centerline (Pitch) : .6 MM [.024 INCH ] Housing Color : Black Housing Material : High Temperature Thermoplastic
Industry Standards UL Flammability Rating : UL 94V-0
Mechanical Attachment Connector Mounting Type : Board Mount PCB Mount Retention : With PCB Mount Retention Type : Solder Peg PCB Mounting Style : Surface Mount
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Box, Tray Packaging Quantity : 20
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Cable-to-Board DRAM Type : Double Data Rate (DDR) 2 Product Type : Socket Sealable : No
Signal Characteristics SGRAM Voltage (V) : 1.8
Termination Features Insertion Style : Cam-In
Usage Conditions Operating Temperature Range : -55 - 85 DEGC [-67 - 185 DEGF ]
Body Features
- Connector Profile : Standard
- Ejector Location : Both Ends
- Ejector Type : Locking
- Latch Material : Stainless Steel
- Latch Plating Material : Tin
- Module Key Type : SGRAM
Configuration Features
- Center Key : None
- Keying : Reverse
- Module Orientation : Right Angle
- Number of Bays : 2
- Number of Keys : 1
- Number of Positions : 200
- Number of Rows : 2
Contact Features
- Contact Base Material : Copper Alloy
- Contact Current Rating (Max) (AMP) : .5
- Contact Mating Area Plating Material : Gold
- PCB Contact Termination Area Plating Material : Gold Flash
- Socket Style : SO DIMM
- Socket Type : Memory Card
Dimensions
- Row-to-Row Spacing : 6.2 MM [.244 INCH ]
- Stack Height : 5.2 MM [.205 INCH ]
Electrical Characteristics
Housing Features
- Centerline (Pitch) : .6 MM [.024 INCH ]
- Housing Color : Black
- Housing Material : High Temperature Thermoplastic
Industry Standards
- UL Flammability Rating : UL 94V-0
Mechanical Attachment
- Connector Mounting Type : Board Mount
- PCB Mount Retention : With
- PCB Mount Retention Type : Solder Peg
- PCB Mounting Style : Surface Mount
Operation/Application
- Circuit Application : Power
Packaging Features
- Packaging Method : Box, Tray
- Packaging Quantity : 20
Product Type Features
- Connector & Contact Terminates To : Printed Circuit Board
- Connector System : Cable-to-Board
- DRAM Type : Double Data Rate (DDR) 2
- Product Type : Socket
- Sealable : No
Signal Characteristics
Termination Features
Usage Conditions
- Operating Temperature Range : -55 - 85 DEGC [-67 - 185 DEGF ]