TE Connectivity SO DIMM Sockets 1473006-4

Description
Body Features Connector Profile : Standard Ejector Location : Both Ends Ejector Type : Locking Latch Material : Stainless Steel Latch Plating Material : Tin Module Key Type : SGRAM Configuration Features Module Orientation : Right Angle Number of Bays : 2 Number of Keys : 1 Number of Positions : 200 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold Flash Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Gold Flash Dimensions Row-to-Row Spacing : 6.2 MM  [.244 INCH ] Stack Height : 5.2 MM  [.205 INCH ] Electrical Characteristics DRAM Voltage (V) : 1.8 Housing Features Centerline (Pitch) : .6 MM  [.024 INCH ] Housing Color : Black Housing Material : High Temperature Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment Type : Reverse Keying PCB Mount Retention : With PCB Mount Retention Type : Solder Peg Operation/Applicatio n Circuit Application : Power Packaging Features Packaging Method : Semi-Hard Tray Assembly Packaging Quantity : 20 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Cable-to-Board DRAM Type : Double Data Rate (DDR) 2 Signal Characteristics SGRAM Voltage (V) : 1.8 Termination Features Insertion Style : Cam-In Termination Method to PCB : Surface Mount Usage Conditions Operating Temperature Range : -55 - 85 DEGC  [-67 - 185 DEGF ]
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Description
Body Features Connector Profile : Standard Ejector Location : Both Ends Ejector Type : Locking Latch Material : Stainless Steel Latch Plating Material : Tin Module Key Type : SGRAM Configuration Features Module Orientation : Right Angle Number of Bays : 2 Number of Keys : 1 Number of Positions : 200 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold Flash Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Gold Flash Dimensions Row-to-Row Spacing : 6.2 MM  [.244 INCH ] Stack Height : 5.2 MM  [.205 INCH ] Electrical Characteristics DRAM Voltage (V) : 1.8 Housing Features Centerline (Pitch) : .6 MM  [.024 INCH ] Housing Color : Black Housing Material : High Temperature Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment Type : Reverse Keying PCB Mount Retention : With PCB Mount Retention Type : Solder Peg Operation/Applicatio n Circuit Application : Power Packaging Features Packaging Method : Semi-Hard Tray Assembly Packaging Quantity : 20 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Cable-to-Board DRAM Type : Double Data Rate (DDR) 2 Signal Characteristics SGRAM Voltage (V) : 1.8 Termination Features Insertion Style : Cam-In Termination Method to PCB : Surface Mount Usage Conditions Operating Temperature Range : -55 - 85 DEGC  [-67 - 185 DEGF ]
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Suppliers

Company
Product
Description
Supplier Links
SO DIMM Sockets - 1473006-4 - TE Connectivity
Berwyn, PA, United States
SO DIMM Sockets
1473006-4
SO DIMM Sockets 1473006-4
Body Features Connector Profile : Standard Ejector Location : Both Ends Ejector Type : Locking Latch Material : Stainless Steel Latch Plating Material : Tin Module Key Type : SGRAM Configuration Features Module Orientation : Right Angle Number of Bays : 2 Number of Keys : 1 Number of Positions : 200 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold Flash Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Gold Flash Dimensions Row-to-Row Spacing : 6.2 MM  [.244 INCH ] Stack Height : 5.2 MM  [.205 INCH ] Electrical Characteristics DRAM Voltage (V) : 1.8 Housing Features Centerline (Pitch) : .6 MM  [.024 INCH ] Housing Color : Black Housing Material : High Temperature Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment Type : Reverse Keying PCB Mount Retention : With PCB Mount Retention Type : Solder Peg Operation/Applicatio n Circuit Application : Power Packaging Features Packaging Method : Semi-Hard Tray Assembly Packaging Quantity : 20 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Cable-to-Board DRAM Type : Double Data Rate (DDR) 2 Signal Characteristics SGRAM Voltage (V) : 1.8 Termination Features Insertion Style : Cam-In Termination Method to PCB : Surface Mount Usage Conditions Operating Temperature Range : -55 - 85 DEGC  [-67 - 185 DEGF ]

Body Features


  • Connector Profile : Standard
  • Ejector Location : Both Ends
  • Ejector Type : Locking
  • Latch Material : Stainless Steel
  • Latch Plating Material : Tin
  • Module Key Type : SGRAM

Configuration Features


  • Module Orientation : Right Angle
  • Number of Bays : 2
  • Number of Keys : 1
  • Number of Positions : 200
  • Number of Rows : 2

Contact Features


  • Contact Base Material : Copper Alloy
  • Contact Current Rating (Max) (AMP) : .5
  • Contact Mating Area Plating Material : Gold Flash
  • Memory Socket Type : Memory Card
  • PCB Contact Termination Area Plating Material : Gold Flash

Dimensions


  • Row-to-Row Spacing : 6.2 MM  [.244 INCH ]
  • Stack Height : 5.2 MM  [.205 INCH ]

Electrical Characteristics


  • DRAM Voltage (V) : 1.8

Housing Features


  • Centerline (Pitch) : .6 MM  [.024 INCH ]
  • Housing Color : Black
  • Housing Material : High Temperature Thermoplastic

Industry Standards


  • UL Flammability Rating : UL 94V-0

Mechanical Attachment


  • Connector Mounting Type : Board Mount
  • Mating Alignment Type : Reverse Keying
  • PCB Mount Retention : With
  • PCB Mount Retention Type : Solder Peg

Operation/Application


  • Circuit Application : Power

Packaging Features


  • Packaging Method : Semi-Hard Tray Assembly
  • Packaging Quantity : 20

Product Type Features


  • Connector & Contact Terminates To : Printed Circuit Board
  • Connector System : Cable-to-Board
  • DRAM Type : Double Data Rate (DDR) 2

Signal Characteristics


  • SGRAM Voltage (V) : 1.8

Termination Features


  • Insertion Style : Cam-In
  • Termination Method to PCB : Surface Mount

Usage Conditions


  • Operating Temperature Range : -55 - 85 DEGC  [-67 - 185 DEGF ]
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Headers & Wire Housings - 1473006-4 - Powell Electronics, Inc.
Swedesboro, NJ, United States
Headers & Wire Housings
1473006-4
Headers & Wire Housings 1473006-4
SEMI-HARD TRAY DDR2 SODIMM SOCKET 200P 5

SEMI-HARD TRAY DDR2 SODIMM SOCKET 200P 5

Buy Now
Swedesboro, NJ, United States
Headers & Wire Housings
1473006-4
Headers & Wire Housings 1473006-4
Headers & Wire Housings

Headers & Wire Housings

Buy Now
IC and Component Socket - 1473006-4 - Richardson RFPD
Downers Grove, IL, United States
IC and Component Socket
1473006-4
IC and Component Socket 1473006-4
Memory Sockets

Memory Sockets

Supplier's Site Datasheet

Technical Specifications

  TE Connectivity Powell Electronics, Inc. Powell Electronics, Inc. Richardson RFPD
Product Category IC Interconnect Components IC Interconnect Components IC Interconnect Components IC Interconnect Components
Product Number 1473006-4 1473006-4 1473006-4 1473006-4
Product Name SO DIMM Sockets Headers & Wire Housings Headers & Wire Housings IC and Component Socket
Product Type IC Socket IC Socket; IC Headers IC Headers
Socket Type DIMM DIMM
Mounting SMT; Board Mount SMT; Solder
Voltage Rating 1.8 volts 1.8 volts
Current Rating 0.5000 amps
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