TE Connectivity Board-to-Board Headers & Receptacles 146701-1

Configuration Features Board-to-Board Configuration : Parallel Number of Positions : 50 PCB Mount Orientation : Vertical Contact Features Contact Current Rating (Max) (AMP) : 3 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .76 MICM  [30 MICIN ] Contact Type : Pin Dimensions Row-to-Row Spacing : 2.54 MM  [.1 INCH ] Housing Features Centerline (Pitch) : 2.54 MM  [.1 INCH ] Housing Color : Black Housing Material : Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : Without PCB Mount Alignment : Without PCB Mount Retention : Without Operation/Applicatio n Circuit Application : Signal Packaging Features Packaging Method : Tube Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board Header Type : Partially Shrouded PCB Connector Assembly Type : PCB Mount Header Sealable : No Termination Features Termination Method to Printed Circuit Board : Through Hole - Press-Fit Usage Conditions Operating Temperature Range : -65 - 105 DEGC  [-85 - 221 DEGF ]