Body Features Contact Removal Style : Front Release/Front Remove
Contact Features Contact Base Material : Copper Contact Current Rating (Max) (AMP) : 1 Contact Mating Area Plating Material : Gold Flash Contact Orientation : Straight Contact Type : Pin
Electrical Characteristics Impedance (OHM) : 100
Identification Marking Contact Color Code : None
Mechanical Attachment Contact Retention Type Within Housing : Snap-In
Operation/Applicatio
n Circuit Application : Signal Solder Process Feature : Solder Dipped
Packaging Features Packaging Method : Package
Product Type Features Connector & Contact Terminates To : Printed Circuit Board RF Contact Style : Quadrax Sealable : No
Termination Features Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -65 - 125 DEGC [-85 - 257 DEGF ]
Body Features
- Contact Removal Style : Front Release/Front Remove
Contact Features
- Contact Base Material : Copper
- Contact Current Rating (Max) (AMP) : 1
- Contact Mating Area Plating Material : Gold Flash
- Contact Orientation : Straight
- Contact Type : Pin
Electrical Characteristics
Identification Marking
- Contact Color Code : None
Mechanical Attachment
- Contact Retention Type Within Housing : Snap-In
Operation/Application
- Circuit Application : Signal
- Solder Process Feature : Solder Dipped
Packaging Features
- Packaging Method : Package
Product Type Features
- Connector & Contact Terminates To : Printed Circuit Board
- RF Contact Style : Quadrax
- Sealable : No
Termination Features
- Termination Method to PCB : Through Hole - Solder
Usage Conditions
- Operating Temperature Range : -65 - 125 DEGC [-85 - 257 DEGF ]