Body Features Primary Product Color : Gray
Configuration Features Number of Positions : 80 Number of Rows : 4 PCB Mount Orientation : Horizontal
Contact Features Contact Current Rating (Max) (AMP) : 10, 12 Contact Mating Area Plating Material : Tin Mating Pin Diameter : 1.61 MM , 2.86 MM [.03 INCH , .11 INCH ] Mating Tab Thickness : .8 MM , .6 MM [.024 INCH ] Mating Tab Width : 2.8 MM , 1.5 MM [.11 INCH , .025 INCH ]
Housing Features Centerline (Pitch) : 2.15 MM [.084 INCH ]
Mechanical Attachment Connector Mounting Type : Board Mount
Operation/Applicatio
n Circuit Application : Power Shielded : No
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Wire-to-Board Hybrid Header : Yes Sealable : No
Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions Operating Temperature Range : -40 - 100 DEGC [-40 - 212 DEGF ]
TE Connectivity
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Description
Body Features Primary Product Color : Gray
Configuration Features Number of Positions : 80 Number of Rows : 4 PCB Mount Orientation : Horizontal
Contact Features Contact Current Rating (Max) (AMP) : 10, 12 Contact Mating Area Plating Material : Tin Mating Pin Diameter : 1.61 MM , 2.86 MM [.03 INCH , .11 INCH ] Mating Tab Thickness : .8 MM , .6 MM [.024 INCH ] Mating Tab Width : 2.8 MM , 1.5 MM [.11 INCH , .025 INCH ]
Housing Features Centerline (Pitch) : 2.15 MM [.084 INCH ]
Mechanical Attachment Connector Mounting Type : Board Mount
Operation/Applicatio
n Circuit Application : Power Shielded : No
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Wire-to-Board Hybrid Header : Yes Sealable : No
Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions Operating Temperature Range : -40 - 100 DEGC [-40 - 212 DEGF ]
Body Features Primary Product Color : Gray
Configuration Features Number of Positions : 80 Number of Rows : 4 PCB Mount Orientation : Horizontal
Contact Features Contact Current Rating (Max) (AMP) : 10, 12 Contact Mating Area Plating Material : Tin Mating Pin Diameter : 1.61 MM , 2.86 MM [.03 INCH , .11 INCH ] Mating Tab Thickness : .8 MM , .6 MM [.024 INCH ] Mating Tab Width : 2.8 MM , 1.5 MM [.11 INCH , .025 INCH ]
Housing Features Centerline (Pitch) : 2.15 MM [.084 INCH ]
Mechanical Attachment Connector Mounting Type : Board Mount
Operation/Applicatio
n Circuit Application : Power Shielded : No
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Wire-to-Board Hybrid Header : Yes Sealable : No
Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions Operating Temperature Range : -40 - 100 DEGC [-40 - 212 DEGF ]
Body Features
Primary Product Color : Gray
Configuration Features
Number of Positions : 80
Number of Rows : 4
PCB Mount Orientation : Horizontal
Contact Features
Contact Current Rating (Max) (AMP) : 10, 12
Contact Mating Area Plating Material : Tin
Mating Pin Diameter : 1.61 MM , 2.86 MM [.03 INCH , .11 INCH ]
Mating Tab Thickness : .8 MM , .6 MM [.024 INCH ]
Mating Tab Width : 2.8 MM , 1.5 MM [.11 INCH , .025 INCH ]
Housing Features
Centerline (Pitch) : 2.15 MM [.084 INCH ]
Mechanical Attachment
Connector Mounting Type : Board Mount
Operation/Application
Circuit Application : Power
Shielded : No
Product Type Features
Connector & Contact Terminates To : Printed Circuit Board
Connector System : Wire-to-Board
Hybrid Header : Yes
Sealable : No
Termination Features
Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions
Operating Temperature Range : -40 - 100 DEGC [-40 - 212 DEGF ]
