TE Connectivity Backplane Power Connectors 1410278-2

Configuration Features

• Backplane Architecture : Orthogonal
• Number of Columns : 2
• Number of Positions : 2
• Number of Power Positions : 2
• Number of Rows : 11
• Number of Signal Positions : 0
• PCB Mount Orientation : Vertical
• Stackable : No

Contact Features

• Contact Base Material : Copper Alloy
• Contact Current Rating (Max) (AMP) : 20
• Contact Length (MM) : 13.7
• Contact Mating Area Plating Material : Gold (Au)
• Contact Mating Area Plating Material Thickness (MICM) : 1.27
• Contact Type : Socket
• PCB Contact Termination Area Plating Material : Tin
• PCB Contact Termination Area Plating Material Finish : Matte
• PCB Contact Termination Area Plating Material Thickness : 1.27 MICM  [50 MICIN ]

Dimensions

• Connector Height (MM) : 16.25
• PCB Hole Diameter (MM) : .61
• PCB Thickness (Recommended) (MM) : 1.4
• Product Length (MM) : 29.59
• Product Width (MM) : 15.25

Electrical Characteristics

• Operating Voltage (VAC) : 250
• Operating Voltage (VDC) : 250

Housing Features

• Centerline (Pitch) : 3.6 MM  [.141 INCH ]
• Housing Color : Black
• Housing Material : Liquid Crystal Polymer (LCP)

Industry Standards

• UL Flammability Rating : UL 94V-0

Mechanical Attachment

• Connector Mounting Type : Board Mount
• Mating Alignment : With
• Mating Alignment Type : Polarization
• PCB Mount Retention : With
• PCB Mount Retention Type : Action/Compliant Tail

Operation/Application

• Circuit Application : Power

Packaging Features

• Packaging Method : Tube

Product Type Features

• Connector & Contact Terminates To : Printed Circuit Board
• Connector System : Board-to-Board
• PCB Connector Type : PCB Mount Receptacle

Termination Features

• Termination Method to PCB : Through Hole - Press-Fit
• Termination Post & Tail Length (MM) : 3.5

Usage Conditions

• Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]