Configuration Features Board-to-Board Configuration : Parallel Number of Positions : 49 PCB Mount Orientation : Vertical
Contact Features Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .3 MICM [11.81 MICIN ] Contact Type : Receptacle
Dimensions PCB Thickness (Recommended) : 1.57 MM [.062 INCH ] Stack Height : 14 MM [.55 INCH ]
Housing Features Housing Material : LCP
Industry Standards UL Flammability Rating : UL 94V-0
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Tray
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector Product Type : Connector Assembly Connector System : Board-to-Board PCB Connector Type : PCB Mount Receptacle Sealable : No
Usage Conditions Operating Temperature Range : -55 - 85 DEGC [-67 - 185 DEGF ]
TE Connectivity
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Description
Configuration Features Board-to-Board Configuration : Parallel Number of Positions : 49 PCB Mount Orientation : Vertical
Contact Features Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .3 MICM [11.81 MICIN ] Contact Type : Receptacle
Dimensions PCB Thickness (Recommended) : 1.57 MM [.062 INCH ] Stack Height : 14 MM [.55 INCH ]
Housing Features Housing Material : LCP
Industry Standards UL Flammability Rating : UL 94V-0
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Tray
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector Product Type : Connector Assembly Connector System : Board-to-Board PCB Connector Type : PCB Mount Receptacle Sealable : No
Usage Conditions Operating Temperature Range : -55 - 85 DEGC [-67 - 185 DEGF ]
Configuration Features Board-to-Board Configuration : Parallel Number of Positions : 49 PCB Mount Orientation : Vertical
Contact Features Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .3 MICM [11.81 MICIN ] Contact Type : Receptacle
Dimensions PCB Thickness (Recommended) : 1.57 MM [.062 INCH ] Stack Height : 14 MM [.55 INCH ]
Housing Features Housing Material : LCP
Industry Standards UL Flammability Rating : UL 94V-0
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Tray
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector Product Type : Connector Assembly Connector System : Board-to-Board PCB Connector Type : PCB Mount Receptacle Sealable : No
Usage Conditions Operating Temperature Range : -55 - 85 DEGC [-67 - 185 DEGF ]
Configuration Features
Board-to-Board Configuration : Parallel
Number of Positions : 49
PCB Mount Orientation : Vertical
Contact Features
Contact Current Rating (Max) (AMP) : .5
Contact Mating Area Plating Material : Gold (Au)
Contact Mating Area Plating Material Thickness : .3 MICM [11.81 MICIN ]
Contact Type : Receptacle
Dimensions
PCB Thickness (Recommended) : 1.57 MM [.062 INCH ]
Stack Height : 14 MM [.55 INCH ]
Housing Features
Housing Material : LCP
Industry Standards
UL Flammability Rating : UL 94V-0
Operation/Application
Circuit Application : Signal
Packaging Features
Packaging Method : Tray
Product Type Features
Connector & Contact Terminates To : Printed Circuit Board
Connector Product Type : Connector Assembly
Connector System : Board-to-Board
PCB Connector Type : PCB Mount Receptacle
Sealable : No
Usage Conditions
Operating Temperature Range : -55 - 85 DEGC [-67 - 185 DEGF ]
