Body Features Primary Product Color : Black
Configuration Features Number of Positions : 2 Number of Rows : 1 PCB Mount Orientation : Horizontal
Contact Features Contact Mating Area Plating Material : Tin (Sn) Contact Type : Tab Mating Tab Thickness : .8 MM [.031 INCH ] Mating Tab Width : 4 MM [.157 INCH ]
Electrical Characteristics Nominal Voltage Architecture (V) : 12
Housing Features Centerline (Pitch) : 9 MM [.354 INCH ]
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With PCB Mount Alignment : With PCB Mount Retention : Without
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Tray
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector Product Type : Connector Assembly Connector System : Wire-to-Board Header Type : Partially Shrouded Mixed & Hybrid Header : No Sealable : No
Termination Features Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature (Max) : 140 DEGC [284 DEGF ] Operating Temperature Range : -35 - 140 DEGC [-31 - 284 DEGF ]
Body Features
- Primary Product Color : Black
Configuration Features
- Number of Positions : 2
- Number of Rows : 1
- PCB Mount Orientation : Horizontal
Contact Features
- Contact Mating Area Plating Material : Tin (Sn)
- Contact Type : Tab
- Mating Tab Thickness : .8 MM [.031 INCH ]
- Mating Tab Width : 4 MM [.157 INCH ]
Electrical Characteristics
- Nominal Voltage Architecture (V) : 12
Housing Features
- Centerline (Pitch) : 9 MM [.354 INCH ]
Mechanical Attachment
- Connector Mounting Type : Board Mount
- Mating Alignment : With
- PCB Mount Alignment : With
- PCB Mount Retention : Without
Operation/Application
- Circuit Application : Power
Packaging Features
Product Type Features
- Connector & Contact Terminates To : Printed Circuit Board
- Connector Product Type : Connector Assembly
- Connector System : Wire-to-Board
- Header Type : Partially Shrouded
- Mixed & Hybrid Header : No
- Sealable : No
Termination Features
- Termination Method to PCB : Through Hole - Solder
Usage Conditions
- Operating Temperature (Max) : 140 DEGC [284 DEGF ]
- Operating Temperature Range : -35 - 140 DEGC [-31 - 284 DEGF ]