Configuration Features Number of Bays : 1 Number of Positions : 7
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] Contact Underplating Material : Nickel
Housing Features Centerline (Pitch) : 1.27 MM [.05 INCH ] Housing Material : Liquid Crystal Polymer (LCP)
Mechanical Attachment Connector Mounting Type : Board Mount PCB Mount Retention : Without
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Tape & Reel
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector & Housing Type : Receptacle Connector System : Cable-to-Board
Termination Features Termination Method to PCB : Surface Mount
Usage Conditions Operating Temperature Range : -10 - 60 DEGC [14 - 140 DEGF ]
TE Connectivity
Done
Request a Quote
Email Supplier
Description
Configuration Features Number of Bays : 1 Number of Positions : 7
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] Contact Underplating Material : Nickel
Housing Features Centerline (Pitch) : 1.27 MM [.05 INCH ] Housing Material : Liquid Crystal Polymer (LCP)
Mechanical Attachment Connector Mounting Type : Board Mount PCB Mount Retention : Without
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Tape & Reel
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector & Housing Type : Receptacle Connector System : Cable-to-Board
Termination Features Termination Method to PCB : Surface Mount
Usage Conditions Operating Temperature Range : -10 - 60 DEGC [14 - 140 DEGF ]
Configuration Features Number of Bays : 1 Number of Positions : 7
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] Contact Underplating Material : Nickel
Housing Features Centerline (Pitch) : 1.27 MM [.05 INCH ] Housing Material : Liquid Crystal Polymer (LCP)
Mechanical Attachment Connector Mounting Type : Board Mount PCB Mount Retention : Without
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Tape & Reel
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector & Housing Type : Receptacle Connector System : Cable-to-Board
Termination Features Termination Method to PCB : Surface Mount
Usage Conditions Operating Temperature Range : -10 - 60 DEGC [14 - 140 DEGF ]
Configuration Features
Number of Bays : 1
Number of Positions : 7
Contact Features
Contact Base Material : Copper Alloy
Contact Current Rating (Max) (AMP) : .5
Contact Mating Area Plating Material : Gold (Au)
Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ]
Contact Underplating Material : Nickel
Housing Features
Centerline (Pitch) : 1.27 MM [.05 INCH ]
Housing Material : Liquid Crystal Polymer (LCP)
Mechanical Attachment
Connector Mounting Type : Board Mount
PCB Mount Retention : Without
Operation/Application
Circuit Application : Signal
Packaging Features
Packaging Method : Tape & Reel
Product Type Features
Connector & Contact Terminates To : Printed Circuit Board
Connector & Housing Type : Receptacle
Connector System : Cable-to-Board
Termination Features
Termination Method to PCB : Surface Mount
Usage Conditions
Operating Temperature Range : -10 - 60 DEGC [14 - 140 DEGF ]
