Body Features Body Material : Zinc Connector & Keying Code : None PCB Retention Feature Plating Material : Tin
Configuration Features Number of Positions : 1 PCB Mount Orientation : Horizontal
Contact Features Center Contact : With Contact Current Rating (Max) (AMP) : 1 Contact Mating Area Plating Material : Gold (Au) Contact Type : Pin Mating Pin Diameter : .5 MM [.02 INCH ] Outer Contact Plating Material : Tin (Sn) RF Connector Center Contact Plating Material : Gold (Au)
Dimensions Connector Height : 8.05 MM [.317 INCH ]
Electrical Characteristics Impedance (OHM) : 50 Operating Voltage (VDC) : 60
Mechanical Attachment Connector Mounting Type : Board Mount Mating Retention : With PCB Mount Retention : With PCB Mount Retention Type : Solder Tail
Operation/Applicatio
n Assembly Process Feature : Board Standoff Circuit Application : Signal Operating Frequency Range (GHZ) : 0 - 3 Shielded : No Solder Process : Wave Solder Capable
Product Type Features Connector System : Wire-to-Device Mixed & Hybrid Connector : No Sealable : No
Termination Features Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature (Max) : 100 DEGC [212 DEGF ] Operating Temperature Range : -40 - 100 DEGC [-40 - 212 DEGF ]
Body Features
- Body Material : Zinc
- Connector & Keying Code : None
- PCB Retention Feature Plating Material : Tin
Configuration Features
- Number of Positions : 1
- PCB Mount Orientation : Horizontal
Contact Features
- Center Contact : With
- Contact Current Rating (Max) (AMP) : 1
- Contact Mating Area Plating Material : Gold (Au)
- Contact Type : Pin
- Mating Pin Diameter : .5 MM [.02 INCH ]
- Outer Contact Plating Material : Tin (Sn)
- RF Connector Center Contact Plating Material : Gold (Au)
Dimensions
- Connector Height : 8.05 MM [.317 INCH ]
Electrical Characteristics
- Impedance (OHM) : 50
- Operating Voltage (VDC) : 60
Mechanical Attachment
- Connector Mounting Type : Board Mount
- Mating Retention : With
- PCB Mount Retention : With
- PCB Mount Retention Type : Solder Tail
Operation/Application
- Assembly Process Feature : Board Standoff
- Circuit Application : Signal
- Operating Frequency Range (GHZ) : 0 - 3
- Shielded : No
- Solder Process : Wave Solder Capable
Product Type Features
- Connector System : Wire-to-Device
- Mixed & Hybrid Connector : No
- Sealable : No
Termination Features
- Termination Method to PCB : Through Hole - Solder
Usage Conditions
- Operating Temperature (Max) : 100 DEGC [212 DEGF ]
- Operating Temperature Range : -40 - 100 DEGC [-40 - 212 DEGF ]
