Contact Features Contact Base Material : Brass Contact Current Rating (Max) (AMP) : 3 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 30 Contact Orientation : Straight Contact Type : Pin PCB Contact Termination Area Plating Material : Gold PCB Contact Termination Area Plating Material Thickness : .76 MICM [29.9212 MICIN ]
Mechanical Attachment PCB Mount Retention : Without Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Carton Packaging Quantity : 1000
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Screw
Usage Conditions Operating Temperature Range : -65 - 125 DEGC [-85 - 257 DEGF ]
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Datasheet
Description
Contact Features Contact Base Material : Brass Contact Current Rating (Max) (AMP) : 3 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 30 Contact Orientation : Straight Contact Type : Pin PCB Contact Termination Area Plating Material : Gold PCB Contact Termination Area Plating Material Thickness : .76 MICM [29.9212 MICIN ]
Mechanical Attachment PCB Mount Retention : Without Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Carton Packaging Quantity : 1000
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Screw
Usage Conditions Operating Temperature Range : -65 - 125 DEGC [-85 - 257 DEGF ]
Contact Features Contact Base Material : Brass Contact Current Rating (Max) (AMP) : 3 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 30 Contact Orientation : Straight Contact Type : Pin PCB Contact Termination Area Plating Material : Gold PCB Contact Termination Area Plating Material Thickness : .76 MICM [29.9212 MICIN ]
Mechanical Attachment PCB Mount Retention : Without Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Carton Packaging Quantity : 1000
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Screw
Usage Conditions Operating Temperature Range : -65 - 125 DEGC [-85 - 257 DEGF ]
Contact Features
Contact Base Material : Brass
Contact Current Rating (Max) (AMP) : 3
Contact Mating Area Plating Material : Gold
Contact Mating Area Plating Material Thickness (MICIN) : 30
Contact Orientation : Straight
Contact Type : Pin
PCB Contact Termination Area Plating Material : Gold
PCB Contact Termination Area Plating Material Thickness : .76 MICM [29.9212 MICIN ]
Mechanical Attachment
PCB Mount Retention : Without
Wire Insulation Support : Without
Operation/Application
Circuit Application : Signal
Packaging Features
Packaging Method : Carton
Packaging Quantity : 1000
Termination Features
Product Terminates To : Printed Circuit Board
Termination Method to PCB : Through Hole - Screw
Usage Conditions
Operating Temperature Range : -65 - 125 DEGC [-85 - 257 DEGF ]