Body Features Contact Removal Style : Rear Release
Contact Features Contact Base Material : Copper Alloy Contact Length : 28.19 MM [1.11 INCH ] Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] Contact Orientation : Straight Contact Type : Pin Rack & Panel Connector Contact Size : 20
Identification Marking Contact Color Code : Red/Orange
Mechanical Attachment Contact Retention Type Within Housing : Retention Clip
Operation/Applicatio
n Solder Process Feature : Solder Dipped
Other Comment : Solder Dipped.
Packaging Features Packaging Method : Package
Product Type Features Connector & Contact Terminates To : Printed Circuit Board
Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder
TE Connectivity
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Description
Body Features Contact Removal Style : Rear Release
Contact Features Contact Base Material : Copper Alloy Contact Length : 28.19 MM [1.11 INCH ] Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] Contact Orientation : Straight Contact Type : Pin Rack & Panel Connector Contact Size : 20
Identification Marking Contact Color Code : Red/Orange
Mechanical Attachment Contact Retention Type Within Housing : Retention Clip
Operation/Applicatio
n Solder Process Feature : Solder Dipped
Other Comment : Solder Dipped.
Packaging Features Packaging Method : Package
Product Type Features Connector & Contact Terminates To : Printed Circuit Board
Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder
Body Features Contact Removal Style : Rear Release
Contact Features Contact Base Material : Copper Alloy Contact Length : 28.19 MM [1.11 INCH ] Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] Contact Orientation : Straight Contact Type : Pin Rack & Panel Connector Contact Size : 20
Identification Marking Contact Color Code : Red/Orange
Mechanical Attachment Contact Retention Type Within Housing : Retention Clip
Operation/Applicatio
n Solder Process Feature : Solder Dipped
Other Comment : Solder Dipped.
Packaging Features Packaging Method : Package
Product Type Features Connector & Contact Terminates To : Printed Circuit Board
Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder
Body Features
Contact Removal Style : Rear Release
Contact Features
Contact Base Material : Copper Alloy
Contact Length : 28.19 MM [1.11 INCH ]
Contact Mating Area Plating Material : Gold
Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ]
Contact Orientation : Straight
Contact Type : Pin
Rack & Panel Connector Contact Size : 20
Identification Marking
Contact Color Code : Red/Orange
Mechanical Attachment
Contact Retention Type Within Housing : Retention Clip
Operation/Application
Solder Process Feature : Solder Dipped
Other
Comment : Solder Dipped.
Packaging Features
Packaging Method : Package
Product Type Features
Connector & Contact Terminates To : Printed Circuit Board
Termination Features
Termination Method to Printed Circuit Board : Through Hole - Solder
